Jobs in the United States

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Added 4 hours ago
IC
Substrate Packaging Research and Development Engineer
Intel Corporation
AZ
- $133,800 to $188,890 USD / year
As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and…
Added 8 hours ago
IC
Module Development Engineer
Intel Corporation
OR
- $115,110 to $162,500 USD / year
As a Module Development Engineer, you will drive technology development and process enablement for both high-volume manufacturing and next-generation semiconductor technologies. You will be…
Added 9 hours ago
Process Integration Engineer
Applied Materials, Inc
Santa Clara, CA · Albany, NY
As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze…
Added 10 hours ago
MQ
Principal Laser & Optical Project Engineer - Photonic Modules
Monarch Quantum
San Diego, CA
- $175,000 to $225,000 USD / year
We’re looking for a laser physicist or optical engineer who has shipped laser-based products at volume, many times over, and wants to apply that experience to a frontier technology. You may…
Added 11 hours ago
Process Integration Engineer
Applied Materials
Santa Clara, CA · Albany, NY · Santa Clara · Albany
As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze…
Added 1 day ago
Senior Product Development Engineer
Inlighten Technologies
Santa Clara, CA
Drive end-to-end development and integration of MicroLED AR display modules, connecting the MicroLED display chip, CMOS backplane, package, driver electronics, and optical engine. Translate…
Added 1 day ago
Business Development Manager
(USA) Quartzdyne
UT
We are seeking an experienced Business Development Sales Engineer to drive growth and diversification of our advanced microelectronics and Multi-Chip Module (MCM) manufacturing business.
Added 1 day ago
IC
Module Development Engineer
Intel Corporation
OR
- $133,800 to $188,890 USD / year
Candidates must possess one of the following:
Added 1 day ago
RF / RFIC Design Engineer
QUANTUM COMPUTING, INC.
Hoboken, NJ
Experience with RF packaging and module integration (e.g., flip-chip bonding, wire bonding, and antenna-in-package (AiP) integration).
Added 3 days ago
SMTS Quantum Etch Engineer
GLOBALFOUNDRIES U.S. INC.
NY
…The role will bridge device and integration requirements with equipment capability, process development, contamination control, manufacturing readiness, and supplier technology…
Added 4 days ago
IC
WPM Integration: Defect Engineer
Intel Corporation
NM · OR
- $103,730 to $146,440 USD / year
You must possess the below minimum qualifications to be initially considered for this position
Added 5 days ago
IC
NM Wafer Packaging Manufacturing: Advanced Packaging Module Engineer
Intel Corporation
NM
- $76,390 to $146,440 USD / year
New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will…
Added 5 days ago
IC
NM Wafer Packaging Manufacturing Advanced Packaging Engineer
Intel Corporation
NM
- $103,730 to $198,820 USD / year
New Mexico Wafer Packaging Manufacturing (NMWPM) is expanding, and we are seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology. These roles will…
Added 5 days ago
Area Field Engineer (OSM)
Bechtel Corporation
Houston, TX
The OSM Area Field Engineer (AFE) supports the Module Yard Manager by leading field engineering activities for module free issue material receipt, assembly, installation, testing,…
Added 5 days ago
Senior Power Electronics Performance & Application Engineer
Mossville, IL
report on-site 5 days per week
Added 5 days ago
Area Field Engineer (OSM)
Bechtel
Houston, TX
The OSM Area Field Engineer (AFE) supports the Module Yard Manager by leading field engineering activities for module free issue material receipt, assembly, installation, testing,…
Added 5 days ago
RC
Modeling & Simulation Engineer (Internship or PT)
Red Cell Partners
Remote, United States
- $70 to $80 USD / hour
…materials, electronics, plasma science, and mission-focused product development. The systems we are developing will reshape how defense, aerospace, and commercial users communicate across…
Added 6 days ago
Senior OCT Test and Verification Engineer
AstraNu, Inc.
Murray Hill, NJ
We are looking for a hands-on Senior OCT Test and Verification Engineer to own the verification chain of our OCT modules, from integrated photonic chips to the packaged module. You will…
Added 6 days ago
IC
Sort/Test Module Engineering Manager
Intel Corporation
NM
- $120,860 to $231,670 USD / year
You must possess the below minimum qualifications to be initially considered for this position
Added 6 days ago
Wafer Bonding Process Engineer, Quantum AI
Google
Goleta, CA
In this role, you will lead the development, integration, and Release to Production of temporary wafer bonding, thinning, and debonding (TB/DB) processes for Google Quantum AI’s…
Added 6 days ago
Recent Graduate-Process Engineer – Advanced Semiconductor Packaging
Keysight Technologies, Inc.
Santa Rosa, CA
…High Frequency Technology Center (HFTC) is seeking a Process Engineer in Advanced Packaging to develop next generation technologies and new products. Experience in microelectronics…
Added 7 days ago
Senior Manufacturing Engineer
Rondo Energy
Alameda, CA
We are looking for a hands-on Manufacturing Engineer to lead the development, optimization, and scale-up of the assembly processes behind our modular thermal battery system, taking it from…
Added 7 days ago
MX
Material Handler - Ship Loose
Module X Solutions
Shreveport, LA
- $20 to $24 USD / hour
MODULE X SOLUTIONS is a rapidly growing modular manufacturing business that serves marquee corporate and government customers in renewable energy, network infrastructure, battery storage,…
Added 8 days ago
Engineer- Manufacturing Technology Scaling II USA
First Solar Inc
Perrysburg, OH
…vacuum deposition, wet coatings and cleans, laser process and module packaging, lamination and electrical testing processes. - Qualify and sustain new process equipment in a 24x7…
Added 8 days ago
R
Staff Electronic Design Engineer
Rivian
Palo Alto, CA
- $186,000 to $232,000 USD / year

Inlighten Technologies

Senior Product Development Engineer

Santa Clara, CA, United States

Apply on inlightentechnologies.bamboohr.com About employer

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Job details

Experience: At least 5 years of relevant experience in display module development, optoelectronic product development, semiconductor integration, or electronic hardware development.
Posting language: English
Posted: Nov 9, 2026

Original job description

Scope:

Drive end-to-end development and integration of MicroLED AR display modules, connecting the MicroLED display chip, CMOS backplane, package, driver electronics, and optical engine. Translate product requirements into module-level specifications and validation plans; coordinate internal teams and external partners; troubleshoot system-level issues; and deliver characterized prototypes for customer evaluation and product commercialization.

Key Responsibilities:

Lead end-to-end integration of MicroLED display chips, CMOS backplanes, package structures, driver boards, and optical engine components.
Translate customer and application needs into module-level requirements, interface definitions, development plans, and measurable performance targets.
Coordinate display, CMOS, packaging, hardware, firmware, optics, test, and manufacturing contributors to resolve cross-subsystem issues.
Bring up and debug display modules, including power delivery, electrical interfaces, timing, grayscale control, pixel behavior, image artifacts, and communication interfaces.
Work with packaging teams and external suppliers on die/backplane integration, bonding and interconnects, assembly builds, alignment, and packaging-related failure analysis.
Integrate MicroLED modules with optical components such as collimation optics, micro-optics, and AR waveguides, as applicable to the product.
Plan and execute electrical and optical characterization covering luminance, wavelength, color, uniformity, grayscale response, optical efficiency, and power consumption.
Analyze engineering data, perform root-cause investigations and design-of-experiments where appropriate, and drive corrective actions and design iterations.
Define module validation procedures, acceptance criteria, and technical documentation; support prototype delivery, customer evaluation, reliability assessment, and manufacturing readiness.

Qualifications & Experience:

The role requires broad product-level integration experience across optoelectronics, display electronics, semiconductor packaging, and optical systems. The engineer must be comfortable debugging hardware and working across disciplines, rather than owning only one subsystem.

Required:

Bachelor’s degree in Electrical Engineering, Optical Engineering, Applied Physics, Materials Science, or a related technical field.
At least 5 years of relevant experience in display module development, optoelectronic product development, semiconductor integration, or electronic hardware development.
Hands-on experience integrating multiple hardware, semiconductors, or optoelectronic components into a functioning product or module.
Experience with hardware bring-up, system debugging, performance characterization, and structured root-cause analysis.
Ability to interpret engineering data, document technical findings, and coordinate resolution of issues across multiple engineering disciplines.
Strong written and verbal communication skills and ability to manage multiple technical tasks in a fast-paced environment.

Preferred:

Direct experience with MicroLED, LED, OLED, LCOS, or other microdisplay technologies.
Experience with AR display modules, near-eye displays, optical engines, waveguides, or precision optical alignment.
Familiarity with CMOS display backplanes, display driver ICs, pixel-driving architectures, and interfaces such as MIPI, SPI, or I²C.
Experience with advanced semiconductor packaging, die bonding, wafer-level packaging, or fine-pitch hybrid bonding.
Experience with driver boards, embedded hardware, display control firmware, and power-delivery considerations.
Hands-on use of optical or electrical characterization equipment, spectrometers, imaging systems, or automated data-acquisition tools.
Proficiency in Python, MATLAB, LabVIEW, or similar tools for engineering data analysis.
Experience with product validation, reliability evaluation, yield improvement, design for manufacturability, or external suppliers.

Skills & Competencies:

System integration: Understand interfaces and interactions among MicroLED devices, CMOS backplanes, packages, driver electronics, and optical subsystems.
Troubleshooting: Isolate electrical, optical, mechanical, packaging, and firmware-related issues using a structured, data-driven approach.
Analytical thinking: Correlate measured results with design and process variables; draw clear conclusions and recommend the next practical steps.
Execution and ownership: Drive open issues to closure, manage competing priorities, and deliver prototypes and documentation on schedule.
Collaboration: Communicate effectively with cross-functional teams, external suppliers, and engineering partners; make technical trade-offs clear.
Attention to detail: Maintain accurate test records, interface specifications, build history, and validation results.

Equal Employment Opportunity

Inlighten Technologies is an equal opportunity employer that is committed to inclusion and diversity. We promote equal opportunity for all applicants without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, veteran status, or any other legally protected characteristics.

Apply on inlightentechnologies.bamboohr.com About employer

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Jobs in the United States