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R&D Thermal Design Engineer - HP Workstations

Fort Collins, United States

$93,400 to $143,800 USD / year

Apply on apply.hp.com About employer

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Job details

Pay: $93,400 to $143,800 USD / year
Apply by: May 10, 2027
Posting language: English
Posted: Nov 11, 2026

Original job description

R&D Thermal Design Engineer - HP Workstations

Description -

About Us: HP Advanced Compute and Solutions (ACS) builds mission-critical workstations for professionals across a range of fields, including architecture, engineering, product design, financial services, medical equipment, defense, and AI development.

Position: ACS R&D Thermal Design Engineer. Join the HP Workstation engineering team to develop thermal and acoustic solutions for high-performance systems. You will influence system architecture, fan-control strategy, acoustics, and reliability as new technologies move from concept to market.

In this role, you will own thermal and acoustic development from early architecture through validation and product readiness, turning analysis and test results into practical system decisions.

Key Responsibilities

Design Excellence: Develop and integrate thermal and acoustic solutions that balance compute performance, acoustics, reliability, cost, and schedule.
Thermal Expertise: Evaluate emerging thermal-management and fan-control technologies and translate promising approaches into system-level designs.
Performance Optimization: Develop and execute validation plans, analyze results, and use the findings to improve thermal, fan-control, acoustic, and reliability performance.
Expert Collaboration: Work with internal teams and external development partners to communicate evidence, resolve trade-offs, and align on design decisions and system requirements.
Strategic Planning: Influence thermal architecture roadmaps and deliver solutions within project scope and budget requirements.

Education and Experience

Education: Bachelor’s or master’s degree in mechanical engineering or a closely related engineering discipline.
Experience: At least three years of relevant experience in computer-system thermal design, validation, fan control, and acoustics optimization.

Skills and Knowledge

Ability to use Computational Fluid Dynamics (CFD) and thermal mockups to predict system behavior, correlate models with test data, and refine designs.
Proficiency with 3D CAD tools, such as ProEngineer, for mechanical design and design communication.
Strong analytical and problem-solving skills, including root-cause analysis and evaluation of technical trade-offs.
Strong written and verbal communication skills in English, including the ability to present proposals, explain trade-offs, and build alignment across technical teams and partner organizations.

Why Join Us? Solve complex thermal and acoustic challenges that affect professionals who depend on HP workstations for demanding, mission-critical work. You will have broad technical scope and influence products from early architecture through validation.

Make Your Mark: If you make sound, evidence-based decisions and enjoy solving complex system challenges, we invite you to help shape the next generation of HP high-performance workstations.

Apply to join HP Advanced Compute and Solutions.

The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies, including;
4-12 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Not Specified

Relocation -

Yes

Equal Opportunity Employer (EEO) \-

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"

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Jobs in the United States