Jobs in the United States

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Added 1 min ago
Information Systems Unix Engineering Unix System Engineer 3
B&H Photo
New York, NY
Maintain and monitor server environments and infrastructure for high availability and disaster recovery requirements
Added 2 mins ago
Lead Senior Cloud Platform Engineer
Stanley Martin Homes, LLC
Reston, VA
A day in the life of a Lead Senior Cloud Platform Engineer begins with partnering with application, data, AI, and infrastructure teams to ensure cloud platforms are enabling the secure,…
Added 4 mins ago
AI Solutions Engineer
Stratolaunch
Mojave, CA
The AI Solutions Engineer contributes to the development, integration, and operation of AI capabilities across Stratolaunch. The Enterprise Software Team integrates a mix of COTS and custom…
Added 5 mins ago
Software Engineer, Lead
The MITRE Corporation
Aberdeen, MD
Familiarity with DevSecOps and infrastructure automation tools, including Helm, CI/CD pipelines such as Jenkins, GitLab CI, or ArgoCD, Infrastructure as Code tools such as Ansible and…
Added 5 mins ago
G
Staff Software Engineer, Applied AI
GridUnity
Remote, United States
- $250,000 to $265,000 USD / year
GridUnity is seeking a Staff Software Engineer to join our Platform team, reporting to the Director of Engineering, Applied AI. You will turn our customer workflow vision into reliable…
Added 8 mins ago
Civil Engineer-In-Training (EIT) - Industrial
AKS Engineering & Forestry, LLC
Kirkland, WA
AKS is seeking a motivated Civil Engineer-in-Training (EIT) to join our team and support the planning, design, and delivery of high-tech manufacturing developments and mission-critical data…
Added 9 mins ago
Principal ASIC Engineer
Echodyne Corp
Kirkland, WA
…uncrewed aircraft & drones, and security of borders, critical infrastructure, and smart cities. The company combines the patented technology of metamaterials with powerful software to…
Added 11 mins ago
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Principal Data Engineering - Remote
UnitedHealth Group
Minnetonka, MN
- $112,700 to $193,200 USD / year
The Principal Data Engineer is a senior individual contributor responsible for designing, building, and scaling enterprise data platforms and data pipelines. This role combines cloud-based…
Added 11 mins ago
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Senior Software Engineer
UnitedHealth Group
Eden Prairie, MN
- $91,700 to $163,700 USD / year
As a Senior Software Engineer on the OCPN Cloud Platform Team, you will drive the architecture, technical design, development, delivery, and operationalization of cloud-native, resilient,…
Added 12 mins ago
Tech Consultant - Infrastructure Patch & Unix Engineer
NTT DATA Americas, Inc.
Jacksonville
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Added 12 mins ago
Unix Engineer - Infrastructure Patch
NTT DATA Americas, Inc.
Jacksonville
We are currently seeking a Unix Engineer - Infrastructure Patch to join our team in Jacksonville, Florida (US-FL), United States (US).
Added 12 mins ago
Spring Migration Engineer
NTT DATA Americas, Inc.
Austin
We are currently seeking a Spring Migration Engineer to join our team in Austin, Texas (US-TX), United States (US).
Added 12 mins ago
RU
Field Engineer
Randstad USA
Mendota, IL
- $60,000 to $75,000 USD / year
…systems. This hybrid role combines the duties of managing network infrastructure with the installation, configuration, and maintenance of voice communication systems. The Field Engineer…
Added 13 mins ago
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Security Engineer II
Coinstar Brand
Remote, United States
- $117,308 to $146,635 USD / year
Coinstar’s Security Engineer II is responsible for the design, implementation and maintenance of security solutions to include email security, network security including firewall…
Added 13 mins ago
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IT System Administration - Senior/Specialist
State of Washington
Olympia, WA
- $8,522 to $11,460 USD / month
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Added 15 mins ago
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Google

Package Design Engineer

Sunnyvale, CA, United States

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Job details

Experience: 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
Posting language: English

Original job description

In most instances, this position requires in-person interviews as part of the hiring process.

Minimum qualifications:

Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
Experience in chip package substrate layout, design verification, DFM and taping out for production.
Experience in design automation and scripting.

Preferred qualifications:

Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
Experience in working with cross-functional teams including chip design, SI/PI, and PCB design teams.
Experience in 2.5D/3.5D advanced package design.
Experience in physical verification flow (LVS, DRC, connectivity).
Experience with CAD for creating simple mechanical drawings, such as package outline drawings (POD).
Ability to write scripts to customize elements of the Cadence or Mentor workflow.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

As a Chip Package Designer on the Silicon Integration team, your role is to develop package substrate designs of advanced (2.5D/3.5D) packaging technologies for ML chips. This involves collaborating with SI/PI, Thermal/Mechanical, Assembly, and PCB engineers to create complex, high-performance substrate designs, where your goal is to optimize package substrate design for electrical performance, reliability, and assembly. You will manage all phases of the design process, including routing feasibility, test vehicle creation, product designs, conducting design reviews, artwork export, DFM process and generating final documentation. Additionally, you will be instrumental in identifying and incorporating advanced chip packaging technologies into the Google chip product design pipeline, which contributes to successful chip deployment in data centers, ensuring the best optimized PPA (Power, Performance, Area) designs and enhancing system performance relative to TCO (Total Cost of Ownership) and power. The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide. We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $163000 - $236000 (USD) + 15% bonus target + equity + benefits

Learn more about benefits at Google.

Develop physical package substrate design of large form-factor package for ML high-performance computers (HPCs).
Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity.
Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs.
Collaborate closely with signal integrity/power integrity (SI/PI), thermal, and mechanical engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility.
Define and document the requirements for the package substrate design and bill of materials (BOM).

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More about this job

Skills

Mechanical engineering
Electrical engineering
Computer engineering
Computer science
Printed circuit boards
Technical drawings
POD
Workflow
Design package
Packaging
ML
Assembly
Design process
Documentation
Google Cloud
Research

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