Jobs in the United States

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Added 8 mins ago
SUPERVISORY ELECTRONICS ENGINEER
Naval Air Systems Command
Jacksonville, FL
Added 10 mins ago
A
Building Engineer
Aerotek
BELLEVUE, WA
- $90,000 to $93,600 USD / year
…well-established property management team as a Building Maintenance Engineer supporting commercial properties in Bellevue. This hands-on role is ideal for someone with experience in HVAC,…
Added 13 mins ago
Reliability Systems Engineer - Level 3 or 4 (AHT)
Northrop Grumman
Redondo Beach, CA · Redondo Beach
Northrop Grumman’s Space Systems Sector is seeking a Reliability Systems Engineer – Level 3 or 4 to join our team in Redondo Beach, CA. This position can be filled at Level 3 Principal…
Added 13 mins ago
EMI/C Systems Engineer - Level 2 (AHT)
Northrop Grumman
Gilbert, AZ · Gilbert
-Designs and develops unique/specialized/efficient test apparatus and testing methodology related to EMI/C and RF electrical testing;
Added 13 mins ago
EMI/C Systems Engineer - Level 3 or 4 (AHT)
Northrop Grumman
Gilbert, AZ · Gilbert
-Designs and develops unique/specialized/efficient test apparatus and testing methodology related to EMI/C and RF electrical testing;
Added 14 mins ago
Mission Manager / Systems Engineer II
Lodestar
Los Angeles, CA
At Lodestar, as a Mission Manager / Systems Engineer II, you will own the success of a defence space mission from concept through to flight. You will be the single point of accountability…
Added 21 mins ago
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Electrical Design Engineer
GPAC
Summerville, SC
- $90,000 to $125,000 USD / year
Product Development: Design and develop electrical schematics, control systems, wiring harnesses, and printed circuit board (PCB) layouts.
Added 22 mins ago
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Electrical Design Engineer
GPAC
Sumter, SC
- $90,000 to $125,000 USD / year
Product Development: Design and develop electrical schematics, control systems, wiring harnesses, and printed circuit board (PCB) layouts.
Added 22 mins ago
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Electrical Design Engineer
GPAC
Goose Creek, SC
- $90,000 to $125,000 USD / year
Product Development: Design and develop electrical schematics, control systems, wiring harnesses, and printed circuit board (PCB) layouts.
Added 22 mins ago
G
Electrical Design Engineer
GPAC
Florence, SC
- $90,000 to $125,000 USD / year
Product Development: Design and develop electrical schematics, control systems, wiring harnesses, and printed circuit board (PCB) layouts.
Added 22 mins ago
G
Electrical Design Engineer
GPAC
Spartanburg, SC
- $90,000 to $125,000 USD / year
Product Development: Design and develop electrical schematics, control systems, wiring harnesses, and printed circuit board (PCB) layouts.
Added 27 mins ago
Sr Validation Engineer (RF, mmWave & Mixed-Signal) - TeraWave
Blue Origin Personnel, LLC
San Diego, CA · Cupertino, CA
…interfaces. As a Senior RF/mmWave & Mixed-Signal Validation Engineer, you prove that silicon works on the bench. You bring up first samples, characterize RF and mixed signal performance…
Added 27 mins ago
Software Engineer II - TeraWave
Blue Origin Personnel, LLC
Cupertino, CA
We are seeking a Software Engineer to join our PoP development team which is the high-performance, fast-path software that powers the TeraWave Point of Presence (PoP).
Added 41 mins ago
Senior Vehicle Power Electronics Engineer
Anduril Industries
Santa Ana, CA · Costa Mesa, CA
Bachelor's degree in Electrical Engineering, Power Electronics, or equivalent
Added 52 mins ago
Mechatronics Engineer III
JPL/NASA
Pasadena, CA
You will be working as a Mechatronics Engineer within the Mechanical Engineering, Integration, and Test Section, which leads the design, analysis, development, integration, and test of…
Added 52 mins ago
Mechanical Engineering Specialist
Lynntech, Inc.
College Station, TX
Lynntech is seeking a mechanical engineer to support the development of technologies, prototypes, and products in the defense, aerospace, and medical domains. A successful candidate will…
Added 1 hour ago
Sr. Antenna Production Engineer
Echodyne Corp
Kirkland, WA
We are seeking an Sr. Antenna Production Engineer to help transition our proprietary antenna technology into manufacturable MESA radar hardware. This role works closely with RF,…
Added 1 hour ago
H
R&D Writing System Engineer
HP
Corvallis
- $93,400 to $143,800 USD / year
…HP’s industry leading print businesses. This Specialist-level engineer primarily supports the PageWide Industrial (PWI) business by leading R&D development and integration of ink and…
Added 1 hour ago
Maintenance Engineer (Engineer 1) - MSS Talent Development Program
Los Alamos National Laboratory
Los Alamos, NM
…a career path towards facilities management. Starting as an Engineer I within the Maintenance and Site Services (MSS) Division, you will be provided the opportunity to experience all…
Added 1 hour ago
R&D Engineer 2/3
Los Alamos National Laboratory
Los Alamos, NM
This position will be filled at either the R&D Engineer 2 or R&D Engineer 3 level, depending on the skills of the selected candidate. Additional job responsibilities (outlined below) will…
Added 1 hour ago
Materials Science Post-Bachelor's Engineer
Los Alamos National Laboratory
Los Alamos, NM
The MST-8 Materials Scattering Team is seeking a post-bachelor's engineer to support in situ microstructural characterization using neutron and synchrotron X-ray sources. The successful…
Added 1 hour ago
Cleared Senior/Principal R&D Electrical Engineer - System Environmental Qualification Testing, Onsite
Sandia National Laboratories
Albuquerque, NM
We are seeking an R&D Electrical Engineer to join our team. This opening provides an excellent opportunity for a highly-motivated individual with a scientific or engineering background to…
Added 1 hour ago
Senior/Principal R&D Electrical Engineer, Strategic RF & Electronics Systems, Onsite
Sandia National Laboratories
Albuquerque, NM
The ideal R&D Electrical Engineer candidate for Sandia National Laboratories will in addition possess the following:
Added 1 hour ago
Sr Electrical Engineer
Leidos
Albuquerque, NM
Leidos Defense Systems is seeking a highly motivated Sr Electrical Engineer who loves collaboration and being a part of something big, to join our team. This role drives the implementation…
Added 1 hour ago
Senior/Principal Mechanical Engineer - Experimental Solid Mechanics, Onsite
Sandia National Laboratories
Albuquerque, NM
…security! We are seeking a highly motivated R&D Mechanical Engineer to join our dynamic team in the Experimental Solid Mechanics…

Google

Package Design Engineer

Sunnyvale, CA, United States

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Job details

Experience: 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
Posting language: English

Original job description

In most instances, this position requires in-person interviews as part of the hiring process.

Minimum qualifications:

Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
Experience in chip package substrate layout, design verification, DFM and taping out for production.
Experience in design automation and scripting.

Preferred qualifications:

Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
Experience in working with cross-functional teams including chip design, SI/PI, and PCB design teams.
Experience in 2.5D/3.5D advanced package design.
Experience in physical verification flow (LVS, DRC, connectivity).
Experience with CAD for creating simple mechanical drawings, such as package outline drawings (POD).
Ability to write scripts to customize elements of the Cadence or Mentor workflow.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

As a Chip Package Designer on the Silicon Integration team, your role is to develop package substrate designs of advanced (2.5D/3.5D) packaging technologies for ML chips. This involves collaborating with SI/PI, Thermal/Mechanical, Assembly, and PCB engineers to create complex, high-performance substrate designs, where your goal is to optimize package substrate design for electrical performance, reliability, and assembly. You will manage all phases of the design process, including routing feasibility, test vehicle creation, product designs, conducting design reviews, artwork export, DFM process and generating final documentation. Additionally, you will be instrumental in identifying and incorporating advanced chip packaging technologies into the Google chip product design pipeline, which contributes to successful chip deployment in data centers, ensuring the best optimized PPA (Power, Performance, Area) designs and enhancing system performance relative to TCO (Total Cost of Ownership) and power. The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide. We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $163000 - $236000 (USD) + 15% bonus target + equity + benefits

Learn more about benefits at Google.

Develop physical package substrate design of large form-factor package for ML high-performance computers (HPCs).
Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity.
Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs.
Collaborate closely with signal integrity/power integrity (SI/PI), thermal, and mechanical engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility.
Define and document the requirements for the package substrate design and bill of materials (BOM).

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More about this job

Skills

Mechanical engineering
Electrical engineering
Computer engineering
Computer science
Printed circuit boards
Technical drawings
POD
Workflow
Design package
Packaging
ML
Assembly
Design process
Documentation
Google Cloud
Research

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