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Added 1 min ago
Tooling Mechanical Design Engineer, Amazon Leo
Amazon Kuiper Manufacturing Enterprises LLC
Redmond, WA
The Tooling Engineer will support the program on path from R&D, through design validation, into production. You will develop, design, analyze, and implement custom tooling and equipment…
Added 1 min ago
Mechanical Engineer, Electronics Packaging, Avionics Mechanical
Amazon Kuiper Manufacturing Enterprises LLC
Redmond, WA
As a Mechanical Engineer on the Avionics Mechanical team, you will design and develop the mechanical implementation of spacecraft electrical systems from early architecture through flight…
Added 10 mins ago
UG
Principal Data Engineering - Remote
UnitedHealth Group
Minnetonka, MN
- $112,700 to $193,200 USD / year
The Principal Data Engineer is a senior individual contributor responsible for designing, building, and scaling enterprise data platforms and data pipelines. This role combines cloud-based…
Added 10 mins ago
UG
Senior Software Engineer
UnitedHealth Group
Eden Prairie, MN
- $91,700 to $163,700 USD / year
As a Senior Software Engineer on the OCPN Cloud Platform Team, you will drive the architecture, technical design, development, delivery, and operationalization of cloud-native, resilient,…
Added 10 mins ago
Spring Migration Engineer
NTT DATA Americas, Inc.
Austin
We are currently seeking a Spring Migration Engineer to join our team in Austin, Texas (US-TX), United States (US).
Added 12 mins ago
CB
Security Engineer II
Coinstar Brand
Remote, United States
- $117,308 to $146,635 USD / year
Coinstar’s Security Engineer II is responsible for the design, implementation and maintenance of security solutions to include email security, network security including firewall…
Added 14 mins ago
Software Engineer II - Argo Applications
Frost Bank
San Antonio, TX
As a Software Engineer II -Argo Applications at Frost, you are our code guru, not only configuring the systems but understanding the why’s behind them. Our software engineers believe in…
Added 14 mins ago
Financial Manager - SES - Tysons, VA
M.C. Dean, Inc
Tysons, VA
M.C. Dean is Building Intelligence®. We design, build, operate, and maintain cyber-physical solutions for the nation’s most recognizable mission critical facilities, secure environments,…
Added 15 mins ago
Telecommunications Engineer 4 - Tysons, VA
M.C. Dean, Inc
Tysons, VA
The Mission Critical Telecommunications Engineer 4 leads Department of the Air Force (DAF) inside plant (ISP) and outside plant (OSP) telecommunications infrastructure engineering support…
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Telecommunications Engineer 2 - San Antonio, TX
M.C. Dean, Inc
San Antonio, TX
The Mission Critical Telecommunications Engineer 2 supports Department of the Air Force (DAF) inside plant (ISP) and outside plant (OSP) telecommunications infrastructure engineering,…
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Telecommunications Engineer 2 - Tysons, VA
M.C. Dean, Inc
Tysons, VA
The Mission Critical Telecommunications Engineer 2 supports Department of the Air Force (DAF) inside plant (ISP) and outside plant (OSP) telecommunications infrastructure engineering,…
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Deployment Network Engineer 4
M.C. Dean, Inc
Springfield, VA
M.C. Dean is Building Intelligence®. We design, build, operate, and maintain cyber-physical solutions for the nation’s most mission-critical facilities, secure environments, complex…
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Design Engineer Staff
M.C. Dean, Inc
Caroline County, VA
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M.C. Dean, Inc
Tysons, VA
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Telecommunications Specialist 4 (Technical Specialist 4) - Tysons, VA
M.C. Dean, Inc
Tysons, VA
Provide ISP/OSP input to the project's lead engineer and program manager for design reviews, plan acceptance, and program team meetings.
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Telecommunications Specialist 2 (Technical Specialist 2) - San Antonio, TX
M.C. Dean, Inc
San Antonio, TX
M.C. Dean is Building Intelligence®. We design, build, operate, and maintain cyber-physical solutions for the nation’s most mission-critical facilities, secure environments, complex…
Added 22 mins ago
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Manufacturing Engineer
Toyon
Goleta, CA
- $100,000 to $160,000 USD / year
…national security applications. We’re seeking a Manufacturing Engineer to help build next-generation RF sensors for some of the world’s most advanced military…
Added 23 mins ago
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Staff Security Engineer
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San Francisco, CA
- $180,000 to $250,000 USD / year
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Added 24 mins ago
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United States
We are seeking a highly motivated and experienced Senior Engineer to join our Retail and Wealth Risk Engineering team under the Enterprise Risk Technology platform. This is an…
Added 24 mins ago
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Senior Systems Administrator - Hybrid Telework
Department of State Hospitals
CA
- $8,625 to $11,557 USD / month
As an IT Specialist II in our Enterprise Infrastructure Team, you’ll be a senior-level technical expert driving the design, security, and operation of both cloud and on-prem infrastructure.…
Added 26 mins ago
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Scientist, In Vitro Pharmacology
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San Carlos, CA
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…distinguish them from healthy cells with unprecedented precision. We engineer targeted biologics that eliminate only the harmful cells, sparing healthy tissue and opening the door to…
Added 26 mins ago
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+ Assist in producing complete HVAC flow diagrams, plumbing riser diagrams, PFDs, and P&IDs from verbal or written descriptions from the design engineer.
Added 27 mins ago
AI Engineer
NCR VOYIX
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Design, develop, and implement machine learning models and algorithms to solve business problems and improve product performance.
Added 28 mins ago
Senior R&D Test Engineer - Electrical
Stryker Employment Company, LLC
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As a Senior R&D Test Engineer, Electrical, you'll work closely with electrical, software, firmware, and systems engineers to evaluate new product designs, troubleshoot technical challenges,…
Added 29 mins ago
Systems Engineer
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The Systems Engineer will join our product support team as an early-career engineer working on system integrations and product upgrades. You’ll help turn customer and stakeholder needs into…

Google

Package Design Engineer

Sunnyvale, CA, United States

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Job details

Experience: 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
Posting language: English

Original job description

In most instances, this position requires in-person interviews as part of the hiring process.

Minimum qualifications:

Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
Experience in chip package substrate layout, design verification, DFM and taping out for production.
Experience in design automation and scripting.

Preferred qualifications:

Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
Experience in working with cross-functional teams including chip design, SI/PI, and PCB design teams.
Experience in 2.5D/3.5D advanced package design.
Experience in physical verification flow (LVS, DRC, connectivity).
Experience with CAD for creating simple mechanical drawings, such as package outline drawings (POD).
Ability to write scripts to customize elements of the Cadence or Mentor workflow.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

As a Chip Package Designer on the Silicon Integration team, your role is to develop package substrate designs of advanced (2.5D/3.5D) packaging technologies for ML chips. This involves collaborating with SI/PI, Thermal/Mechanical, Assembly, and PCB engineers to create complex, high-performance substrate designs, where your goal is to optimize package substrate design for electrical performance, reliability, and assembly. You will manage all phases of the design process, including routing feasibility, test vehicle creation, product designs, conducting design reviews, artwork export, DFM process and generating final documentation. Additionally, you will be instrumental in identifying and incorporating advanced chip packaging technologies into the Google chip product design pipeline, which contributes to successful chip deployment in data centers, ensuring the best optimized PPA (Power, Performance, Area) designs and enhancing system performance relative to TCO (Total Cost of Ownership) and power. The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide. We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $163000 - $236000 (USD) + 15% bonus target + equity + benefits

Learn more about benefits at Google.

Develop physical package substrate design of large form-factor package for ML high-performance computers (HPCs).
Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity.
Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs.
Collaborate closely with signal integrity/power integrity (SI/PI), thermal, and mechanical engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility.
Define and document the requirements for the package substrate design and bill of materials (BOM).

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More about this job

Skills

Mechanical engineering
Electrical engineering
Computer engineering
Computer science
Printed circuit boards
Technical drawings
POD
Workflow
Design package
Packaging
ML
Assembly
Design process
Documentation
Google Cloud
Research

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