XILINX: Mechanical Hardware Designer

General Mechanical Design:

• As per Xilinx’s specifications either written or verbal, create a mechanical solution that meet Xilinxs requirements.
• Provide complete documentation and all design files to reproduce and manufacture the design.
• Interact with vendors and finalize details, ensure best quality at best price.

PCB Solidworks Modeling:

• Model the PCB, critical mechanical component placement and provide step file, easm (or other compatible) file and renderings of the top, bottom and side view.
• Document the work and make any required changes to the model as per Xilinx specification.
• Identify and work with manufacturer to produce the mechanical solution
• Prepare all required mechanical/electrical specifications for producing the thermal/mechanical solution.
• Consider Design for Manufacturability (DFM) practices.
• Solicit bids from different manufacturers and propose a production plan.
• Once manufacturer is chosen, verify and approve final design and drawing produced by manufacturer.

Perform thermal analysis:

• Perform thermal analysis based on measurement data and/or thermal properties of critical components provided by Xilinx Engineering.
• Define target operating conditions for the board based on use models and refine the test environment to reflect those use cases.
• Based on these measurements and conditions, develop a simulation environment that will accurately model the board and system.

Recommend a thermal solution:

• Based on the findings of the thermal analysis, recommend an optimal thermal solution that will provide sufficient cooling for the design, cost and size must be considered.
• Thermal solutions can be active (fan + heatsink) or passive (heatsink only) and be either custom or off-the-shelf.

Validation:

• Provide support for procuring initial samples for test (thermal, mechanical or others).
• Based on the test result from the conditions previously developed to meet target performance, make any required changes to finalize solution.

Documentation:

• Provide full documentation of test setup and simulation environment allowing reproduction of all results.
• Provide full assembly instructions for the board assembly contractor.