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Senior Software Developer
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The ideal candidate is a strong hands-on engineer who can embrace a contract-first, evidence-based workflow, acting as an architect-supervisor of AI - someone who takes ownership of complex…
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Senior Android Software Engineer
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Lead Engineer- Modeling & Simulation
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Added 1 min ago
Manufacturing Engineer II
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Product Design Engineer II or III
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Automation Engineer II
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Senior Software Engineer
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Dynetics Tech Sol, Inc

Process Engineer

Huntsville, AL, United States

Pay Range $59,150.00 - $106,925.00 The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary.

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Job details

Pay: Pay Range $59,150.00 - $106,925.00 The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary.
Posting language: English
Posted: Nov 6, 2026

Original job description

Looking for an opportunity to make an impact?

At Leidos, we deliver innovative solutions through the efforts of our diverse and talented people who are dedicated to our customers’ success. We empower our teams, contribute to our communities, and operate sustainably. Everything we do is built on a commitment to do the right thing for our customers, our people, and our community. Our Mission, Vision, and Values guide the way we do business.

Your greatest work is ahead! We are seeking a motivated, hands-on Process Engineer to support in the development, implementation, and ramp-up of a new, state-of-the-art electronics manufacturing facility. This position offers an exciting opportunity to help shape manufacturing capabilities from the ground up, supporting facility layout development, equipment installation, commissioning, and process optimization across Surface Mount Technology (SMT), conformal coating, inspection, and automated test operations. The candidate will collaborate with Manufacturing Engineering, Industrial Engineering, Quality, Facilities, and Operations teams to establish efficient production workflows, optimize equipment utilization, and ensure seamless transitions from PCBA manufacturing through subassembly and final integration.

If this sounds like the kind of environment where you can thrive, keep reading!

Leidos Defense Systems Sector / Manufacturing provides a diverse portfolio of systems, solutions, and services covering land, sea, air, space, and cyberspace for customers worldwide. Solutions for Defense include enterprise and mission IT, large-scale intelligence systems, command and control, geospatial and data analytics, cybersecurity, logistics, training, and intelligence analysis and operations support. Our team is solving the world’s toughest security challenges for customers with “can’t fail” missions. To explore and learn more, click here!

Are you ready to make an impact? Apply and share your resume with us today!

Primary Responsibilities

Candidate will develop, document, and execute manufacturing processes and procedures for electronic products.
Candidate will support production of printed circuit board assemblies through various processes. Processes include SMT, Through Hole Selective Solder, Press fit, Conformal Coating and a variety of other processes related to PCBA manufacturing.
Applicant will work with a multi-disciplinary team to develop a wide variety of hardware, and work with the latest automated technology used in assembly and test equipment.
Candidate will support tasks such as creating machine programs and overseeing the execution of manufacturing activities.
Candidate will be required to work closely with the operations team to complete all details of the assembly, and ultimately to prepare the assembly for delivery to customer.
Candidate will also work closely with our manufacturing team including engineering, operations, and quality team to develop processes that validate customer quality requirements.
Candidate will work closely with production control to meet desired delivery schedule

Basic Qualifications

Requires a BS degree and 2-4 years of prior relevant experience or Masters with 0-2 years of prior relevant experience. In lieu of a degree, a highschool diploma/GED with 6 years of experience will be considered
Experience with Costpoint Material Planning software and/or Agile/Windchill product lifecycle management software is a plus. Experience in various quality roles is also a plus. Experience in using Manufacturing Execution Systems (MES) is also a plus.
Candidate must be able to demonstrate strong leadership skills, attention to detail, and ability to work independently. Ability to multi-task well is also essential.
Candidate must have experience working with design engineers, manufacturing engineers, and technicians to develop a build strategy and identify any problems that could occur during assembly.
Candidate will be required to have the basic computer skills associated with these assembly tasks (such as retrieving the manufacturing documentation from the system, updating the system as router steps are completed, etc.).
Candidate must be a resident of the North Alabama area or willing to relocate to the Huntsville - North Alabama, AL area.
Candidate must be a US Citizen and possess (and be able to maintain) a Final Secret Clearance OR meet the eligibility to obtain (and maintain) a Secret Clearance

Preferred Qualificaations

Preferred candidate will have at least 2 years of manufacturing experience on programs building electronic hardware to government specifications (or similar).
Preferred candidate will have experience in the following processes and equipment: ASM pick and place, DEK screen printers, BTU ovens, PVA coating machine, Pillarhouse or JUKI selective solder.
Experience with software that maintains bills of materials, and other engineering design data.
Experience with electronics used on launch vehicles, targets, or missile components, and with production of cable harnesses, electronics, and electromechanical assemblies.
Experience in various quality roles is also a plus.
Experience in using Manufacturing execution systems (MES) is also a plus.
Electronic component handling requirements and ESD procedures.
Current or prior certification to IPC/WHMA-A-610 & J-STD-001.

If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo - because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 - and moving faster than anyone else dares.

Original Posting:

November 6, 2026 For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:

Pay Range $59,150.00 - $106,925.00 The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.

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