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Added 2 days ago
Cybersecurity and Compliance Senior Manager or Director, Texas Institute for Electronics
The University of Texas at Austin
AUSTIN, TX
TIE is looking for Manager or Director of Cybersecurity Compliance to work on site in Austin, TX, and support the strategy and introduction of products based on unique and highly…
Added 3 days ago
CryoCMOS Design Director, Quantum
GLOBALFOUNDRIES U.S. INC.
United States
…differentiated integrated circuit solutions for quantum and other advanced applications. The manager will provide technical direction, organizational leadership, and execution ownership…
Added 4 days ago
Director Purchasing- Foundry and Advanced Packaging
Advanced Micro Devices, Inc
Austin, TX
Coordinate the management and spend of AMD’s foundry suppliers (wafer or post fab / advanced packaging) reporting directly to the Sr. Director of Procurement.
Added 4 days ago
Principal/Senior Principal MMIC RFIC Design Engineer
Northrop Grumman
Baltimore
Support the development of MMIC and RFIC products for advanced, cutting-edge systems and applications as part of an industry-leading, technically broad, foundry-independent design team.
Added 4 days ago
Principal/Senior Principal MMIC RFIC Design Engineer
CORP-Corporate Office
United States
Support the development of MMIC and RFIC products for advanced, cutting-edge systems and applications as part of an industry-leading, technically broad, foundry-independent design team.
Added 4 days ago
Manager Programs 2 - Advanced Packaging
Northrop Grumman
Apopka
The Northrop Grumman Microelectronics Center is seeking an Advanced Packaging Program Manager, Level 2 to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced…
Added 4 days ago
DF
Application Engineering Director
Diamond Foundry
Bay Area, CA
- $180,000 to $270,000 USD / year
Diamond Foundry is seeking an experienced Director of Application Engineering to lead how our single-crystal diamond is integrated into semiconductor devices, with a focus on advanced…
Added 5 days ago
Manager Programs 2 - Advanced Packaging
CORP-Corporate Office
United States
The Northrop Grumman Microelectronics Center is seeking an Advanced Packaging Program Manager, Level 2 to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced…
Added 6 days ago
AI Engineering Manager
Solstice Advanced Materials
Morris Plains, NJ
As an AI Engineering Manager at Solstice, you will play a pivotal role in driving AI initiatives across various business functions using multiple technology platforms. You will translate…
Added 6 days ago
Director Design Engineering
MIPS Holding Inc
United States
We are seeking an experienced and highly accomplished Director of Design Engineering to lead the development and execution of complex SoC programs across advanced semiconductor…
Added 8 days ago
Director, Global ASIC Capacity Planning and Strategy
Cisco Systems, Inc.
San Jose, CA
As Director, Global Capacity Planning & Strategy, you will build and implement the long-term capacity strategy that supports Cisco's Silicon One business around the world. Working across…
Added 9 days ago
ST
Sr. Director Business Development - Quantum Foundry
SkyWater Technology
Bloomington, MN
- $194,640 to $243,300 USD / year
The Senior Director, Quantum Foundry Business is the commercial leader responsible for defining and executing SkyWater's Quantum Foundry growth strategy. This role drives customer…
Added 10 days ago
Director, Business Operations
onsemi
Scottsdale, AZ · San Jose, CA
Partner across Product Development, Engineering, Manufacturing, Quality, and Supply Chain to align product roadmaps, qualifications, transfers, packaging, tooling, and test readiness with…
Added 12 days ago
Cybersecurity Compliance Manager
Insight Global
Austin, TX
…unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies. Their mission is to advance the state-of-the-art in…
Added 16 days ago
T
Account Manager/Technical Manager
TSMC
San Jose, CA
- $131,500 to $187,000 USD / year
The Account Manager serves as a primary commercial and operational interface between TSMC North America and its advanced-node and 3DIC customers, managing the business relationship across…
Added 16 days ago
Panel Packaging Technology Enablement Director
Applied Materials, Inc
Santa Clara, CA · Austin, TX
Applied Materials is building the equipment, process, and integration capability that makes panel-level packaging a production-ready scaling path for AI accelerators and high-performance…
Added 16 days ago
Panel Packaging Technology Enablement Director
Applied Materials
Santa Clara, CA · Austin, TX · Santa Clara · Austin
Applied Materials is building the equipment, process, and integration capability that makes panel-level packaging a production-ready scaling path for AI accelerators and high-performance…
Added 16 days ago
ST
Director of Advanced Packaging Process Engineering
SkyWater Technology Foundry, Inc.
Kissimmee, FL
- $184,400 to $276,600 USD / year
Our Process Engineering Director is accountable to ensure the Process Engineering Team is continuously optimizing our manufacturing processes to be highly efficient with high yields and low…
Added 16 days ago
NS
Senior Director of NPI Program Management
NAVITAS SEMICONDUCTOR USA, INC.
Irvine, CA
- $210,000 to $285,000 USD / year
Navitas Semiconductor is seeking a Senior Director of NPI Program Management to lead and personally run our most critical new product introduction programs across the GaN and SiC…
Added 17 days ago
RF Foundry Business, Director
MACOM Technology Solutions Holdings, Inc.
Durham, NC
development, wafer fabrication, circuit design, advanced packaging, systems
Added 17 days ago
R&D Senior Architect, Package Substrate EDA
Synopsys
Sunnyvale, CA
…technologists, shaping how Synopsys and the industry approach advanced packaging…
Added 17 days ago
KC
Director, Product Marketing
KLA Corporation
Milpitas, CA
- $199,300 to $348,800 USD / year
Monitor industry trends (Logic/Foundry, DRAM, 3D NAND, and advanced packaging) to anticipate future requirements
Added 17 days ago
KC
Director, Technical Program Management - Broadband Plasma (Capital Equipment)
KLA Corporation
Milpitas, CA
- $219,500 to $384,100 USD / year
…quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection…
Added 18 days ago
Senior Product Development & Brand Manager
Pulse Trading Cards
Remote, United States
Our portfolio includes brands such as Big League Chew, Foundry, Drift, and Aura, with an expanding pipeline of sports, entertainment, and consumer-brand collaborations. We’re looking for a…
Added 18 days ago
IC
Foundry Services Director Segment Marketing
Intel Corporation
CA · AZ · OR
- $221,810 to $313,140 USD / year
Intel Foundry Services is Intel's dedicated foundry organization, providing world-class semiconductor manufacturing, advanced packaging, and systems foundry capabilities to external…

CORP-Corporate Office

Manager Programs 2 - Advanced Packaging

United States

Primary Level Salary Range: $139,100.00 - $208,700.00

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Job details

Pay: Primary Level Salary Range: $139,100.00 - $208,700.00
Posting language: English
Posted: Oct 27, 2026

Original job description

RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE REQUIRED FOR START: No

CLEARANCE TYPE: Secret

TRAVEL: Yes, 10% of the TimeDescription

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

The Northrop Grumman Microelectronics Center is seeking an Advanced Packaging Program Manager, Level 2 to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced Packaging team full-time on-site in Apopka, FL. The selected candidate must be able to travel domestically as required by business needs.

For more than 70 years, Northrop Grumman’s Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.

The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense & commercial systems. We focus on development, prototyping, maturation, and scaling of advanced packaging technologies to meet the needs of our customers across these industries.

The selected candidate will be responsible for leading business execution for semiconductor wafer post-processing. Their primary objective will be developing advanced packaging proposals, introducing new products and processes, and delivering all contractual requirements to our customers on-cost and on-schedule. They will oversee the development and achievement of all technical objectives, as well as numerous contractual requirements including: managing cost, schedule, and technical performance; leading interfaces with internal and external customers, and company support organizations; supporting insertion of these technologies into customer use cases; identifying volume growth and cost reduction opportunities; and interfacing with technical leadership across our customer base to identify technology needs and timelines to support next-generation microelectronics systems.

What You'll Get to Do:

Program Managers are responsible for leading all phases of the program life cycle from inception (proposal technical solution and cost development) through startup, execution, and completion (contract closeout). Primary responsibilities are the management of cost, schedule, and technical performance of company programs and include, but are not limited to:

Developing new business opportunities and customer relationships through long term strategic planning, capture planning, and new technology insertion and business plans.
Leading engagements with customers to develop, mature, and deploy advanced packaging solutions.
Leading and directing cross-functional teams to meet program cost, schedule and technical performance objectives across both development and production efforts.
Measuring and reporting program performance.
Delivering proposals and presentations to customers, executive management and other program stakeholders.
Development and adherence to budget baselines utilizing Earned Value Management (EVM) or similar cost & schedule control methodologies and tools.
Identifying, allocating and managing program resources, including workforce planning.
Managing Northrop Grumman capital and government/customer supplied property or information (GFE, CFE, etc.)
Managing suppliers & subcontractors to meet program objectives.
Adherence to all internal processes, policies, and applicable industry standards.
Ensuring teams adhere contract scope, and manages change through control board activities.
Development and adherence to master plans and schedules.
Conducting thorough risk & opportunity management practices including identification, mitigation and realization.

Basic Qualifications:

Bachelor’s degree with 8+ years of relevant professional experience, Master’s degree with 6+ years of relevant professional experience, or PhD with 3+ years of relevant professional experience in program/project management, engineering, manufacturing, microelectronics, or a related field.
Demonstrated experience leading programs, projects, or integrated product teams with responsibility for schedule, cost/budget, technical performance, and program deliverables.
Demonstrated technical experience supporting semiconductor or microelectronics design, fabrication, manufacturing, and/or advanced packaging.
Demonstrated experience preparing and delivering technical or programmatic communications, including proposals, white papers, program reviews, and/or presentations to customers, program leadership, and technical stakeholders.
Demonstrated experience applying Earned Value Management (EVM) and schedule-management principles to monitor program cost and schedule performance.
U.S. citizenship required.
Must have the ability to obtain and maintain a U.S. government Secret security clearance.

Preferred Qualifications:

Active/current U.S. government Secret security clearance.
Master’s or PhD in Engineering, Physics, Materials Science, Electrical Engineering, Microelectronics, Semiconductor Engineering, or a related technical discipline.
Experience managing research, development, manufacturing, and/or technology maturation programs involving microelectronics, semiconductors, or advanced packaging.
Experience working with U.S. Government, defense, and/or commercial customers to define technical requirements and solutions.
Experience supporting customer acquisition, capture, proposal development, program planning, and/or program execution processes.
5+ years of experience leading semiconductor or microelectronics technology-development, manufacturing, or production programs.
Experience supporting RF and/or digital system products, capabilities, and enabling technologies.
Experience applying agile principles, including breaking work into manageable increments, managing parallel work activities, and incorporating regular stakeholder or customer feedback.
Familiarity with FAR and DFARS requirements.

What We Can Offer You Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family. Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off and Additional Benefits including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!

Primary Level Salary Range: $139,100.00 - $208,700.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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More about this job

Skills

Packaging
Microelectronics
Cost management
Leadership
Customer relations
Strategic planning
Reporting
Presentation skills
Project management
Materials science
Electrical engineering
Research
Define technical requirements
Training and development

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