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Added 15 mins ago
2027 Summer Internship: Design Engineer- Chassis Development
PACCAR
Denton, TX
…Peterbilt and DAF nameplates. PACCAR also designs and manufactures advanced power trains, provides financial services and information technology, and distributes truck parts related to its…
Added 26 mins ago
Product Pathfinding Engineer- HIG-TPG
Micron Technology
Boise, ID · Boise
Micron Technology is searching for its next Product Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team!
Added 1 hour ago
Controls Engineer II
Barry-Wehmiller
Denver, CO
…clients in the food & beverage, life sciences, industrial, and advanced technology industries to build the future of manufacturing and…
Added 1 hour ago
Superintendent, Construction
Barry-Wehmiller
Pasadena, CA · Phoenix, AZ · Sacramento, CA
…clients in the food & beverage, life sciences, industrial, and advanced technology industries to build the future of manufacturing and…
Added 2 hours ago
Software Sales Associate Director - Procurement Software/Tech
Accenture LLP Company
NY
…814,000 people with proprietary assets and platforms, deep process and industry expertise, and leading ecosystem relationships to deliver end-to-end solutions and measurable outcomes at…
Added 2 hours ago
Compartment Integration Design Engineer – 2D/3D Math and VR/MR
General Motors LLC
Warren, MI
General Motors is seeking a Compartment Integration Design Engineer (CIDE) to support General Arrangement / vehicle packaging, 3D part creation for physical buck development, and Virtual…
Added 2 hours ago
Senior Product Development Engineer
NVIDIA USA
CA
Experience with multi-chiplet products utilizing advanced packaging
Added 2 hours ago
Distinguished Hardware Engineer
Cisco Systems, Inc.
San Jose, CA
Advanced Packaging: Architect next Generation 2.5D/3D heterogeneous integration strategies, resolving complex thermal, power, delivery, and signal integrity challenges for large sale AI and…
Added 2 hours ago
Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis)
SpaceX
Bastrop, TX
We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic…
Added 2 hours ago
Advanced Package Development Engineer
Apple
CA
- Define specs, drive process windows, and establish advanced packaging solutions (2.5D/3D, hybrid bonding, high-density wafer-level interconnects).
Added 2 hours ago
Epitaxy/CVD Process Development Engineer (SM1)
Texas Instruments
Sherman, TX
…precision: adding exactly the right material, at exactly the right process parameters, without disturbing localized films and area. At SMFAB in Sherman, these processes don’t yet exist in…
Added 2 hours ago
Control Systems Engineer (Instrumentation & Controls)
HDR
Folsom, CA · Walnut Creek, CA
…environment. This isn’t just a job, it’s a chance to lead innovation, engineer impact, and build a legacy of…
Added 2 hours ago
F
Build Your Robotics Career - Explore the Country as a Robotics Field Service Engineer or Technician
Formic
Bolingbrook, IL · Oakland, CA
- $25 to $32 USD / hour
…experienced technician ready for bigger challenges or an accomplished engineer looking for your next chapter, you'll work with cutting-edge robotics, solve meaningful technical problems,…
Added 3 hours ago
Application Engineer IV (E4)
Applied Materials, Inc
Santa Clara, CA
Minimum 3+ years of proven industry experience in wafer inspection, or advanced packaging process, with demonstrated hands-on experience supporting manufacturing and customer applications.
Added 3 hours ago
R
Staff Electronic Design Engineer
Rivian
Palo Alto, CA
- $186,000 to $232,000 USD / year
Added 3 hours ago
Application Engineer IV (E4)
Applied Materials
Santa Clara, CA · Santa Clara
Minimum 3+ years of proven industry experience in wafer inspection, or advanced packaging process, with demonstrated hands-on experience supporting manufacturing and customer applications.
Added 3 hours ago
KC
Computational Physics Algorithm Engineer
KLA Corporation
Milpitas, CA
- $136,300 to $231,700 USD / year
…and memory chips, specialty semiconductors, wafers, reticles, advanced packaging, process equipment and materials. We also develop technologies for specialty processes, IC substrates, and…
Added 3 hours ago
Software Engineering Intern
KLA Corporation
Austin, TX
…and memory chips, specialty semiconductors, wafers, reticles, advanced packaging, process equipment and materials. We also develop technologies for specialty processes, IC substrates, and…
Added 3 hours ago
KC
Software Engineer
KLA Corporation
Milpitas, CA
- $114,800 to $195,200 USD / year
…and memory chips, specialty semiconductors, wafers, reticles, advanced packaging, process equipment and materials. We also develop technologies for specialty processes, IC substrates, and…
Added 4 hours ago
IC
Senior Product Failure Analysis Engineer
Intel Corporation
OR
- $140,830 to $198,820 USD / year
Intel Foundry is building the future of semiconductor manufacturing by delivering process technology, advanced packaging, and manufacturing solutions for customers around the world. As a…
Added 4 hours ago
P
Senior Endpoint Engineer
Procom
Remote, United States
- $110,000 USD / year
Senior Endpoint Engineer: On behalf of our technology client, Procom is searching for a Senior Endpoint Engineer for a permanent role. This position is a remote position and the client is…
Added 4 hours ago
A
Application Engineer
Actalent
Greenville, SC
- $43.7 to $48.7 USD / hour
Job Title: Application Engineer Windows Virtual Desktop (VDI)Job DescriptionThis role serves as the primary technical owner of the Windows Virtual Desktop Infrastructure (VDI) for an…
Added 4 hours ago
Product Development Engineer
Pregis LLC
Grand Rapids, MI
We're Not Just in the Packaging Business–We're in the "Wow" Business
Added 4 hours ago
Externals Design Engineer Intern (Summer 2027) (Onsite)
RTX
United States
…analysis; oil and thermal management systems; engine externals packaging and architecture; and nacelles for both commercial and military engine models. Key technical disciplines include…
Added 4 hours ago
Manager, DRAM Product Planning
Samsung Semiconductor
San Jose, CA
Semiconductor Fundamentals: Familiarity with fab processes, semiconductor manufacturing, and advanced packaging.

Closed listing

Cisco

Distinguished Hardware Engineer

San Jose, CA, United States

This opening has closed.

The original listing is kept below for reference.

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Job details

Posting language: English
Posted: Nov 2, 2026

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Original job description

Archived listing. The details below describe a past opening.

The application window is expected to close on: 11/05/2026Meet the Team

The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco’s core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms - like Silicon One - are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow. Because full product development - from design to qualification to production - is within our team, we’re able to think differently, experiment more, and work quickly. Join us to power the future of the digital world.

Your Impact

As a Distinguished Engineer, you will serve as a technical visionary and advisor to Cisco’s engineering business and senior management. You will lead and influence key industry boards, councils, and standards bodies, define and drive the adoption of next-generation technologies, and guide the development of new products and processes. Your expertise will have a broad impact across Cisco’s product portfolio, shaping strategy, research, open-source efforts, and intellectual property development. You will:

Drive the long-term technical vision and roadmap for next-generation semiconductor nodes and emerging Angstrom technologies.
Strategic Planning: Lead Technology pathfinding and process-design interactions to evaluate futuristic capabilities and quantify technical risks.
Risk Management: Drive strategic technology selection and architectural governance under uncertainty to ensure long-tern product viability.
Bridge the gap between device physics, architecture, and physical implementation to maximize system efficiency.
DTCO Leadership: Pioneer Design-Technology Co-Optimization (DTCO) methodologies to acheive breakthrough gains in Performance, Power, Area, and Cost (PPAC).
Advanced Packaging: Architect next Generation 2.5D/3D heterogeneous integration strategies, resolving complex thermal, power, delivery, and signal integrity challenges for large sale AI and networking systems.
Influence the external semiconductor and EDA ecosystem to accelerate Cisco's development cycles.
EDA Partnership: Collaborate with top-tier EDA vendors to influence tool architecture and co-develop next generation physical design flows for extreme-scale ASICs.
Foundry Interlock: Serve as a Primary technical authority in engagements with leading foundries and IP suppliers to steer PDK definitions and silicon rule decks.
Flow Convergence: Drive the convergence of custom and automated Place and Route (P&R) flows to close the performance gap in semi-custom digital architectures.
Balance aggressive technical targets with business realities and cultivate engineering excellence.
TCO Governance: Provide holistic governance balancing microarchitectural performance against manufacturability, yield and Total Cost of Ownership (TCO).
Technical Mentorship: evaluate the global Silicon One engineering organization by mentoring principal engineers and technical leads to foster a culture of innovation.
Cross-Functional Partnership: Partner with senior leadership across Architecture, Physical Design, Package and Silicon Operations, as well as external industry standards bodies.

Minimum Qualifications

Bachelors in Electrical Engineering, Computer Engineering, Microelectronics, Materials Science, or related technical field + 17 years of advanced ASIC/SoC silicon design and physical implementation experience or Masters + 14 years of related experience, or PhD + 10 years of related experience.
Experience with technical leadership at the Fellow, Distinguished Engineer, or Chief Architect level, with multi-generation tapeout successes on cutting-edge process nodes (sub-5nm, 3nm, 2nm, or GAA architectures).
Experience in Design-Technology Co-Optimization (DTCO), transistor/device physics interactions, standard cell library architecture, and standard memory/SRAM optimization for extreme-scale ASICs.
Experience with hands-on and architectural design across full-chip physical design flows, including synthesis, automated Place & Route (Innovus / Fusion Compiler), static timing analysis (PrimeTime / Tempus), clock tree/mesh synthesis, and power/IR-drop analysis (RedHawk / Voltus).
Experience defining or implementing advanced 2.5D (interposer/UCIe/D2D) and 3D heterogeneous packaging architectures, including power integrity and thermal envelope management.
Technical leadership experience with major semiconductor foundries (e.g., TSMC, IFS, Samsung) and tier-1 EDA software vendors, driving PDK enhancements and tool capability roadmaps.

Preferred Qualifications

Ph.D. in Electrical Engineering, Solid-State Physics, or Microelectronics with extensive industry recognition, including published papers in leading technical conferences (IEDM, VLSI, DAC, ISSCC) and an extensive patent portfolio in silicon design and semiconductor methodology.
Direct experience architecting baseline process-design interactions and foundational design methodologies for industry-defining process nodes (e.g., 14A, 10A, A14, sub-2nm Angstrom nodes).
Demonstrated track record of innovating and deploying automated P&R flows on high-performance custom/semi-custom architectures to bridge the performance gap between full-custom and standard ASIC design.
Demonstrated ability to make pivotal silicon architectural decisions with incomplete early data (e.g., evaluating and committing to Gate-All-Around / RibbonFET architectures 2–3 years ahead of silicon fab runs).
Experience evaluating engineering choices against Total Cost of Ownership (TCO), silicon manufacturability, yield economics, and system-level platform constraints.
Prior experience guiding engineering leaders through significant technical and product challenges.
Exceptional verbal and written communication skills with proven ability to distill complex semiconductor physics and architectural trade-offs into actionable technical strategy for executive stakeholders.

Why Cisco? At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere. We are Cisco, and our power starts with you.

Message to applicants applying to work in the U.S. and/or Canada:

The starting salary range posted for this position is $284,700.00 to $390,900.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits. Individual pay is determined by the candidate's hiring location, market conditions, job-related skillset, experience, qualifications, education, certifications, and/or training. The full salary range for certain locations is listed below. For locations not listed below, the recruiter can share more details about compensation for the role in your location during the hiring process.

U.S. employees are offered benefits, subject to Cisco’s plan eligibility rules, which include medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, paid parental leave, short and long-term disability coverage, and basic life insurance. Please see the Cisco careers site to discover more benefits and perks. Employees may be eligible to receive grants of Cisco restricted stock units, which vest following continued employment with Cisco for defined periods of time.

U.S. employees are eligible for paid time away as described below, subject to Cisco’s policies:

10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco
Non-exempt employees** receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees
Exempt employees participate in Cisco’s flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)
80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours of unused sick time carried forward from one calendar year to the next
Additional paid time away may be requested to deal with critical or emergency issues for family members
Optional 10 paid days per full calendar year to volunteer

For non-sales roles, employees are also eligible to earn annual bonuses subject to Cisco’s policies.

Employees on sales plans earn performance-based incentive pay on top of their base salary, which is split between quota and non-quota components, subject to the applicable Cisco plan. For quota-based incentive pay, Cisco typically pays as follows:

.75% of incentive target for each 1% of revenue attainment up to 50% of quota;
1.5% of incentive target for each 1% of attainment between 50% and 75%;
1% of incentive target for each 1% of attainment between 75% and 100%; and
Once performance exceeds 100% attainment, incentive rates are at or above 1% for each 1% of attainment with no cap on incentive compensation.

For non-quota-based sales performance elements such as strategic sales objectives, Cisco may pay 0% up to 125% of target. Cisco sales plans do not have a minimum threshold of performance for sales incentive compensation to be paid.

The applicable full salary ranges for this position, by specific state, are listed below:

New York City Metro Area:

$284,700.00 - $449,500.00

Non-Metro New York state & Washington state:

$272,000.00 - $398,000.00

For quota-based sales roles on Cisco’s sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined. ** Employees in Illinois, whether exempt or non-exempt, will participate in a unique time off program to meet local requirements.

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