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Closed listing

Cisco

Advanced Packaging & Integration Engineer

San Jose, CA, United States

This opening has closed.

The original listing is kept below for reference.

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About employer

Job details

Experience: 4+ years of progressive industry experience in advanced packaging with a proven track record of successful project execution in high-density integration.
Posting language: English
Posted: Nov 9, 2026

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Original job description

Archived listing. The details below describe a past opening.

The application window is expected to close on: 11/20/2026Cisco is seeking a highly capable Advanced Packaging engineer to join Cisco's Packaging Technology & Quality team within our world-class Global Supply Chain. You will be instrumental in driving advanced packaging technology development to support Cisco’s ground breaking silicon photonic technology roadmap including optical engines, co-packaged optics and on-board optics. The ideal candidate brings broad packaging technology experience and a strong curiosity to pursue innovative solutions.

Your Impact

You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and cross-functional environment. You will engage directly with counterparts at OSATs, foundries, and key suppliers to drive the development of innovative packaging technologies - specifically focused on heterogeneous integration - from early-stage conceptualization through qualification. This role offers significant cross-organizational visibility and the opportunity to shape critical technology roadmaps and influence long-term product platforms.

Key Responsibilities

Advanced packaging technology development engineer focused on silicon photonic packaging and electronic-photonic integration, including 2.5D/3D chip stacking, heterogenous integration, and ultra-fine pitch interconnect technologies.
Drive definition, design and analysis of packaging technology test vehicles. Drive validation of new technology against key performance metrics.
Apply deep process expertise to oversee wafer processing, fine pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly.
Work with top-tier foundry and assembly partners to develop and qualify robust packaging solutions for high density photonics integration, CPO and on-board optics.
Utilize design and modeling experience to guide Design for Manufacturability (DfM) and Design for Reliability (DfR).
Identify and mitigate risks, resolving highly complex packaging issues through advanced root cause analysis and the implementation of corrective actions.

Minimum Qualifications

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field.
4+ years of progressive industry experience in advanced packaging with a proven track record of successful project execution in high-density integration.
Comprehensive knowledge of advanced interconnect materials, process and assembly, including ultra-fine pitch technologies and hybrid bonding.
Hands-on experience with CAD tools such as kLayout, APD, Solidworks

Preferred Qualifications

Knowledge of physical failure analysis methods.
Hands-on experience with hybrid bonding and thin die/wafer processing
Working knowledge of finite element analysis
Deep understanding of next-generation substrate and PCB design and materials, and their influence on packaging performance.
Expertise in si photonic co-integration (CPO, NPO) is a plus
Proven ability to work effectively within highly multi-functional and geographically distributed technical teams.

Why Cisco? At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere. We are Cisco, and our power starts with you.

Message to applicants applying to work in the U.S. and/or Canada:

The starting salary range posted for this position is $154,900.00 to $225,300.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits. Individual pay is determined by the candidate's hiring location, market conditions, job-related skillset, experience, qualifications, education, certifications, and/or training. The full salary range for certain locations is listed below. For locations not listed below, the recruiter can share more details about compensation for the role in your location during the hiring process.

U.S. employees are offered benefits, subject to Cisco’s plan eligibility rules, which include medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, paid parental leave, short and long-term disability coverage, and basic life insurance. Please see the Cisco careers site to discover more benefits and perks. Employees may be eligible to receive grants of Cisco restricted stock units, which vest following continued employment with Cisco for defined periods of time.

U.S. employees are eligible for paid time away as described below, subject to Cisco’s policies:

10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco
Non-exempt employees** receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees
Exempt employees participate in Cisco’s flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)
80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours of unused sick time carried forward from one calendar year to the next
Additional paid time away may be requested to deal with critical or emergency issues for family members
Optional 10 paid days per full calendar year to volunteer

For non-sales roles, employees are also eligible to earn annual bonuses subject to Cisco’s policies.

Employees on sales plans earn performance-based incentive pay on top of their base salary, which is split between quota and non-quota components, subject to the applicable Cisco plan. For quota-based incentive pay, Cisco typically pays as follows:

.75% of incentive target for each 1% of revenue attainment up to 50% of quota;
1.5% of incentive target for each 1% of attainment between 50% and 75%;
1% of incentive target for each 1% of attainment between 75% and 100%; and
Once performance exceeds 100% attainment, incentive rates are at or above 1% for each 1% of attainment with no cap on incentive compensation.

For non-quota-based sales performance elements such as strategic sales objectives, Cisco may pay 0% up to 125% of target. Cisco sales plans do not have a minimum threshold of performance for sales incentive compensation to be paid.

The applicable full salary ranges for this position, by specific state, are listed below:

New York City Metro Area:

$154,900.00 - $259,100.00

Non-Metro New York state & Washington state:

$136,500.00 - $228,300.00

For quota-based sales roles on Cisco’s sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined. ** Employees in Illinois, whether exempt or non-exempt, will participate in a unique time off program to meet local requirements.

About employer

More about this job

Skills

Packaging
Supply chain management
Assembly
Photonics
Root cause analysis
Mechanical engineering
Electrical engineering
Dassault Systemes SolidWorks
Printed circuit boards
Packaging functions
Create solutions to problems
Work as a team
Sales

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