Jobs in the United States

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Added 15 hours ago
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Added 1 day ago
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Added 4 days ago
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Sr Principal Application Engineer
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United States
Hands-on work with Cadence customers in the areas of Backend Digital Design Implementation and Signoff including Synthesis, Place and Route, Design Closure, and timing/power signoff, RTL to…
Added 4 days ago
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Application Engineer
CADENCE US
United States
- $157,500 to $292,500 USD / year
…demands exceptional technical depth, hands-on experience of design convergence, and the ability to align cross-functional teams toward delivering advanced design solutions for leading…
Added 4 days ago
Staff ASIC Design Engineer
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Added 4 days ago
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Head of Platform & Infrastructure Engineering
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Remote, United States
- $340,000 to $400,000 USD / year
Added 4 days ago
Principal R&D Engineer, RF & Impant Power
Synchron Inc.
San Diego, CA
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Added 4 days ago
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Added 5 days ago
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Added 5 days ago
R&D Engineer, IC Design
Broadcom Corporation
United States
Added 5 days ago
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United States
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Fabrication Backend Engineer, AWS CQC - Fabrication
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The Center for Quantum Computing (CQC) is seeking a fabrication backend engineer. The CQC is a multi-disciplinary team of scientists, engineers, and technicians, on a mission to develop a…
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Engineering Lab Infrastructure and Rework Engineer
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Design electrical enclosures and panel layouts using 3D CAD.
Added 5 days ago
Software Engineer II
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United States
Cadence Design Systems is looking for a highly motivated Software Engineer II to join the Innovus R&D team.
Added 5 days ago
Software Engineer II
Cadence
United States
Cadence Design Systems is looking for a highly motivated Software Engineer II to join the Innovus R&D team.
Added 5 days ago
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AI Machine Learning Engineer 1-KR-7455
Onyx Point, Inc.
Hanover, MD
- $78,000 to $250,000 USD / year
TO BE CONSIDERED FOR THIS POSITION YOU MUST HAVE AN ACTIVE TS/SCI W/ FULL SCOPE POLYGRAPH SECURITY CLEARANCE (U.S · Responsible for leading geographically diverse teams and will often serve as a primary POC for Al-related matters, so must have

Broadcom

R&D Engineer IC Design

San Jose, CA, United States

$120,000 to $192,000 USD / year

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Job details

Pay: $120,000 to $192,000 USD / year
Posting language: English
Posted: Nov 19, 2025

Original job description

USA-CA San Jose Innovation Drive

Full time

R024221

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Job Description:

We are part of the core switching group (CSG) at Broadcom developing industry leading network switches for enterprise and mega scale data centers . We are looking for experienced engineers to design cutting edge CoWos 2.5D , 3D interposer designs. You will be working on designing interposers starting with custom routing for high speed interfaces, bump map design , routing and physical verification and tapeout to the foundries. As part of your job you will be interacting with packaging , signal integrity and foundries to meet the packaging, SI and physical requirements of the interposers. Experience with interposer designs including CoWoS, 2.5D/3D integration using Cadence Innovus/Integrity or Synopsys 3DIC compiler is a must. Candidates should have a strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies. Strong automation expertise related to bump pattern generation , routing structure development for high speed interfaces, and chip finishing are required to handle multiple Interposer designs in parallel. Basic understanding of routing structure impact on high-speed signal integrity (SI), power integrity (PI), and thermal analysis is required.

Technical Skills & Experience:

Experience with interposer and advanced packaging design, including CoWoS, 2.5D/3D
Proficiency with EDA tools such as Cadence (Innovus, Integrity), Synopsys (3DIC compiler), Mentor Graphics (Calibre) for layout generation, editing and verification
Strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies.
Basic understanding of high-speed signal integrity (SI), power integrity (PI), and thermal analysis.
Familiarity with semiconductor fabrication processes, particularly for silicon interposers.
Strong scripting skills (Python, Tcl, SKILL) for automation and flow customization.
Ability to work with cross-functional teams including IC design engineers, packaging egineers, and foundries

Additional Skills:

Strong problem-solving skills and attention to detail.
Excellent communication and teamwork skills.
Ability to document design processes, specifications, and reviews.
Familiarity with 3DBlox interposer modelling language is a plus

Preferred Qualifications:

Hands-on experience with high-density interposers in complex packaging environments.
Strong scripting skills to automate the interposer design flow
Previous experience at semiconductor or advanced packaging companies.

Educational Background:

Bachelor’s in Electrical Engineering, Microelectronics, or related fields and 8+ years of related experience, or a Master’s degree and 6+ years of related experience

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $120,000 - $192,000

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library (http://www.broadcom.com/videos) and check out our Connected by Broadcom (https://www.broadcom.com/support/resources/video-webinar-library?channel=5c9658f7c1d34eca91c6cc16178e5b1b&video=7d72b04ea50046a394e682fab640ce20) series.

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Jobs in the United States