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Broadcom Corporation

ATE Engineer - XPU (Yield, Quality & RMA)

United States

$121,900 to $195,000 USD / year

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Job details

Pay: $121,900 to $195,000 USD / year
Apply by: May 8, 2027
Experience: Minimum 8+ years of experience in Test Development, yield enhancement, and RMA failure analysis on ATE floors.
Posting language: English
Posted: Nov 9, 2026

Original job description

Please Note:

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Job Description:

ATE Test Engineer – XPU Yield, Quality, and RMA Debug The major responsibilities for this ATE Test engineering position will be to drive testing, yield optimization, quality assurance, and RMA failure analysis for high-performance XPU ASIC parts (monolithic and 2.5D/3D advanced packaging) on Advantest PS1600, PS400B UHC4, and 93K PinScale/Exascale testers.

Responsibilities:

XPU Test Development & Optimization:
Test bring-up, silicon characterization, flow development, and test time optimization for XPU devices on ATE platforms.
Develop and deploy robust ATE test solution recipes and patterns for product silicon.
Yield & Quality Enhancement:
Perform ATE test data analysis, shmoo characterizations, and guardband tuning to drive silicon yield improvements and reduce DPPM.
Execute ASIC/XPU temperature and voltage corner testing to ensure product quality and screening efficacy.
RMA & Failure Analysis:
Lead characterization, fault isolation, and root-cause debug of customer RMA parts (monolithic and 2.5D/3D advanced packaging XPUs).
Provide feedback to design, DFT, and quality teams to prevent test escapes and resolve systemic product issues.
Reliability & Test Hardware Management:
Manage ATE testing required for pre- and post-reliability and environmental stress testing.
Oversee test file/revision control and maintain DUT hardware and load boards.
Collaboration & Execution:
Collaborate with Design Center, Quality, and worldwide Test Engineering teams to share technical learnings.
Coordinate with overseas R&D test partners and multi-site design teams.

Qualifications:

BS or MS in Electrical/Computer Engineering with a strong background in ASIC/XPU ATE testing, especially with Advantest 93K systems.
Minimum 8+ years of experience in Test Development, yield enhancement, and RMA failure analysis on ATE floors.
Demonstrated experience testing complex ASIC/XPU parts (monolithic and 2.5D packaging).
Strong software/scripting skills and familiarity with Linux RedHat and SmarTest (e.g., versions 7.x, 8.x).

Excellent debug, root cause analysis, and communication skills.

Compensation and Benefits

The annual base salary range for this position is USD 121,900.00 To USD 195,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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More about this job

Skills

Quality assurance
Packaging
Data analysis
DFT
Test hardware
Collaboration
Computer engineering
Linux
Root cause analysis
Communication skills

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