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AI Engineer
Fractal Analytics Inc
TX
Fractal is a strategic AI partner to Fortune 500 companies with a vision to power every human decision in the enterprise. Fractal is building a world where individual choices, freedom, and…
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Construction Project Engineer (Data Center)
AECOM
North Las Vegas, NV
- $65,000 to $118,000 USD / year
We offer competitive pay and benefits, well-being programs to support you and your family, and the development resources you need to advance your career.
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Forward Deployed Engineer, Internal Data Products
AECOM
Remote, United States
- $95,000 to $120,000 USD / year
AECOM Construction Management is seeking a Forward Deployed Engineer, Internal Data Products to turn everyday business challenges into applications that help construction teams work more…
Added 3 mins ago
Manufacturing Engineer
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The Manufacturing Engineer plans, directs, and coordinates manufacturing processes in industrial plant: Develops, evaluates, and improves manufacturing methods, utilizing knowledge of…
Added 3 mins ago
Radiological Assistance Program Nuclear Scientist/Engineer
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Lead Software Engineer
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Rockville, MD · Tysons, VA
…death and dismemberment, supplemental life, spouse/domestic partner and dependent life, and spouse/domestic partner and dependent accidental death and dismemberment, short- and long-term…
Added 5 mins ago
Z5
Environmental Qualification & Design Engineer
Zone 5 Technologies
San Luis Obispo, CA
- $171,000 to $230,000 USD / year
Zone 5 Technologies, LLC is seeking a highly skilled Environmental Qualification & Design Engineer to lead the environmental testing, validation, and design integration of advanced…
Added 5 mins ago
Senior Engineer, Product and Process Engineering
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…are delivered to patients with cardiovascular disease. You’ll partner cross-functionally with manufacturing operations and sales teams, delivering thoughtful solutions to complex challenges…
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Physical Security Systems Integration Engineer
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Data Engineer Client Data Operations
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- $115,000 to $145,000 USD / year
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Lead Guidewire PolicyCenter Software Development Engineer Test (SDET) - HYBRID
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Civil/Geo Applications Engineer - Rotational Development Program (July 2027)
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- $67,700 to $93,200 USD / year
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Civil/Geo Applications Engineer - Rotational Development Program (July 2027)
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- $67,700 to $93,200 USD / year
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Senior Structural Engineer
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- $140,000 to $175,000 USD / year
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Sr Applications Engineer - 2288
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Design Engineer, North America AMZL Design Engineering
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Closed listing

Broadcom

Advanced Package Technology Engineer

San Jose, CA, United States

This opening has closed.

The original listing is kept below for reference.

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Job details

Posting language: English
Posted: Nov 2, 2026

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Original job description

Archived listing. The details below describe a past opening.

USA-CA San Jose Innovation Drive

USA-Colorado-Fort Collins-4380 Ziegler Road

Full time

R027541

Please Note:

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Job Description:

Role Overview

As a key member of the Worldwide (WW) ASIC Product Development team, you will collaborate closely with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers. You will lead the development of cost-effective, high-performance, advanced custom packaging solutions that meet stringent signal integrity, thermal, structural reliability, design rule, and project schedule requirements.

With 2.5D and 3D technologies pushing the boundaries of modern packaging, you will play a pivotal role in driving cutting-edge architectures to meet future customer and product demands.

Key Responsibilities

Technology Leadership: Serve as the subject matter expert in 2.5D and 3D advanced packaging technologies, engaging with current and future customers to define needs, consolidate requirements, and drive unified solutions.
Partner & Program Management: Lead the identification, development, and qualification of advanced packaging solutions, overseeing program management with external assembly and memory partners to define technology and quality requirements.
Cross-Functional Collaboration: Interface seamlessly with internal technical teams - including Design Integration, Package Design, and Test Development - as part of a dynamic cross-functional team.
NPI & Sourcing Support: Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps, while driving alternate sourcing and qualification initiatives.

Candidate Qualifications & Requirements

Education & Experience: Ph.D./ Master’s degree in Mechanical, Electrical, or Electronics Engineering, with 10+ years of relevant experience.
Packaging Expertise: Proven track record in developing cost-effective, high-performance (optimized for speed, density, pin count, thermal performance, and reliability) single- and multi-chip solutions.
Substrates & Interposers: Experience with large, complex, custom, and fine-pitch flip-chip packaging solutions utilizing advanced multi-layer ceramic/organic substrates and interposers, as well as wafer-level packaging solutions.

Specific Qualifications

Advanced Packaging: 6+ years of hands-on experience in 2.5D / 3D package development and heterogeneous integration.
Process & Materials Know-How: In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes, alongside materials selection, supplier evaluation, BOM definition, and thermal-mechanical interactions.

Additional Competencies

Technical Skills:
Comprehensive knowledge of prevailing and emerging silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards/quality systems.
Hands-on experience using thermal and mechanical modelling tools, alongside substrate/PCB design CAD tools (e.g., APD, AutoCAD, SolidWorks) for design optimization.
Solid understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
Soft Skills: A self-driven, flexible, agile, and results-oriented team player with strong analytical, problem-solving, project management, and interpersonal skills. Proven ability to conceptualize structured projects, innovate around complex problems, and manage multiple programs concurrently.
Communication & Travel: Excellent communication skills for extensive collaboration with global internal/external teams and customers. Periodic travel may be required.

Compensation and Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library (http://www.broadcom.com/videos) and check out our Connected by Broadcom (https://www.broadcom.com/support/resources/video-webinar-library?channel=5c9658f7c1d34eca91c6cc16178e5b1b&video=7d72b04ea50046a394e682fab640ce20) series.

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