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Senior Facilities Engineer
Jones Lang Lasalle
LATHAM, NY
…as we help shape a brighter way forward. Senior Facilities Engineer - JLLLocation:Onsite - Philips, Latham, NYWhat this job involves:The Senior Facilities Engineer is a critical member of…
Added just now
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
WHITE PLAINS, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Atlanta, GA Travel: Up to 75% (regional and national project assignments)…
Added just now
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
WHITE PLAINS, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Texas Travel: Up to 75% (regional and national project assignments) Employment…
Added just now
Utilities Planning and Renewal Senior Engineer
Cornell University
ITHACA, NY
…Description SummaryThe Utilities Planning and Renewal Team Senior Engineer provides engineering and project leadership for the University's power, steam, hot water, chilled water, and…
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VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
BINGHAMTON, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Texas Travel: Up to 75% (regional and national project assignments) Employment…
Added just now
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
BINGHAMTON, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Atlanta, GA Travel: Up to 75% (regional and national project assignments)…
Added just now
Software AI Engineer / Robotics / Brooklyn
Kelly Services
Brooklyn, NY
As a Software Engineer, you’ll build the core software that powers an AI platform and autonomous laboratory systems. This is a generalist role spanning backend services, agent tools, data…
Added 1 min ago
Engineer Manager
National Grid USA Service Company, Inc.
SYRACUSE, NY
…influence strategic decisions, and help ensure the safety, reliability, and performance of the electric grid. This is an opportunity to combine technical leadership, team development, and…
Added 1 min ago
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
BUFFALO, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Atlanta, GA Travel: Up to 75% (regional and national project assignments)…
Added 1 min ago
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
BUFFALO, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Texas Travel: Up to 75% (regional and national project assignments) Employment…
Added 1 min ago
Software Engineer, CDP - Stablecoin
Coinbase
Albany, NY
…growth, and ecosystem expansion at Coinbase. As a Software Engineer, you'll help deliver a suite of international stablecoins by evaluating and integrating external partner APIs, building…
Added 1 min ago
AT
Senior II Site Reliability Engineer
Akamai Technologies, Inc.
Albany, NY
- $146,400 to $263,600 USD / year
As a Senior Site Reliability Engineer, you will be responsible for:
Added 1 min ago
AT
Senior II Site Reliability Engineer
Akamai Technologies, Inc.
Albany, NY
- $146,400 to $263,600 USD / year
As a Senior II Site Reliability Engineer, you will be responsible for:
Added 1 min ago
AT
Site Reliability Engineer II
Akamai Technologies, Inc.
Albany, NY
- $95,000 to $171,000 USD / year
As a Site Reliability Engineer II, you will be responsible for:
Added 1 min ago
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
ALBANY, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Texas Travel: Up to 75% (regional and national project assignments) Employment…
Added 1 min ago
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
ALBANY, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Atlanta, GA Travel: Up to 75% (regional and national project assignments)…
Added 1 min ago
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
ALBANY, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Atlanta, GA Travel: Up to 75% (regional and national project assignments)…
Added 1 min ago
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
ALBANY, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Texas Travel: Up to 75% (regional and national project assignments) Employment…
Added 1 min ago
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
ROCHESTER, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Atlanta, GA Travel: Up to 75% (regional and national project assignments)…
Added 1 min ago
C
Mobile HVAC Engineer
CBRE
Cheektowaga, NY · Rochester, NY · Amherst, NY · North Tonawanda, NY
- $56,500 to $80,500 USD / year
PeopleSoft Job Code/Title: Mobile Engineer (ET0045)
Added 1 min ago
VC
ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
ROCHESTER, NY
- Up to $95 USD / hour
Job Description Field Engineer - Electrical Testing (NETA Level III/IV) Company: Vertiv (ERS / HVM) Location: Texas Travel: Up to 75% (regional and national project assignments) Employment…
Added 1 min ago
Principal Software Engineer, Ads
DoorDash
New York, NY
As a Principal Engineer on Ads, you will serve as the technical leader for the Ads organization, setting architectural direction and driving the long term technical strategy for the systems…
Added 1 min ago
Sr Software Engineer II - Full Stack - The Card Shop
American Express
New York, NY
We are looking for a Senior Software Engineer – Web Full Stack with strong expertise in JavaScript, TypeScript, Node.js, React, and modern web technologies to join an agile,…
Added 1 min ago
AE
Sr Software Engineer I - JavaScript - The Card Shop
American Express
New York, NY
- $123,000 to $215,250 USD / year
…to shop for American Express products. As a Senior Software Engineer and hands-on tech lead, you will guide the architecture and delivery of high-impact web capabilities built with…
Added 1 min ago
Full-stack Engineer 5 (Java, Spring, Kafka, CI/CD, AI tools, Glue, RDS, DynamoDB) (Enterprise Platforms Technology )
Capital One
New York, NY
We are seeking a highly skilled and visionary Full- Stack Engineer 5 who is passionate about Artificial Intelligence, Machine Learning, full-stack systems, and leveraging cutting-edge…

Closed listing

Broadcom

Advanced Package Technology Engineer

Fort Collins, CO, United States

This opening has closed.

The original listing is kept below for reference.

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Job details

Posting language: English
Posted: Nov 2, 2026

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Original job description

Archived listing. The details below describe a past opening.

USA-CA San Jose Innovation Drive

USA-Colorado-Fort Collins-4380 Ziegler Road

Full time

R027541

Please Note:

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If you already have a Candidate Account, please Sign-In before you apply.

Job Description:

Role Overview

As a key member of the Worldwide (WW) ASIC Product Development team, you will collaborate closely with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers. You will lead the development of cost-effective, high-performance, advanced custom packaging solutions that meet stringent signal integrity, thermal, structural reliability, design rule, and project schedule requirements.

With 2.5D and 3D technologies pushing the boundaries of modern packaging, you will play a pivotal role in driving cutting-edge architectures to meet future customer and product demands.

Key Responsibilities

Technology Leadership: Serve as the subject matter expert in 2.5D and 3D advanced packaging technologies, engaging with current and future customers to define needs, consolidate requirements, and drive unified solutions.
Partner & Program Management: Lead the identification, development, and qualification of advanced packaging solutions, overseeing program management with external assembly and memory partners to define technology and quality requirements.
Cross-Functional Collaboration: Interface seamlessly with internal technical teams - including Design Integration, Package Design, and Test Development - as part of a dynamic cross-functional team.
NPI & Sourcing Support: Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps, while driving alternate sourcing and qualification initiatives.

Candidate Qualifications & Requirements

Education & Experience: Ph.D./ Master’s degree in Mechanical, Electrical, or Electronics Engineering, with 10+ years of relevant experience.
Packaging Expertise: Proven track record in developing cost-effective, high-performance (optimized for speed, density, pin count, thermal performance, and reliability) single- and multi-chip solutions.
Substrates & Interposers: Experience with large, complex, custom, and fine-pitch flip-chip packaging solutions utilizing advanced multi-layer ceramic/organic substrates and interposers, as well as wafer-level packaging solutions.

Specific Qualifications

Advanced Packaging: 6+ years of hands-on experience in 2.5D / 3D package development and heterogeneous integration.
Process & Materials Know-How: In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes, alongside materials selection, supplier evaluation, BOM definition, and thermal-mechanical interactions.

Additional Competencies

Technical Skills:
Comprehensive knowledge of prevailing and emerging silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards/quality systems.
Hands-on experience using thermal and mechanical modelling tools, alongside substrate/PCB design CAD tools (e.g., APD, AutoCAD, SolidWorks) for design optimization.
Solid understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
Soft Skills: A self-driven, flexible, agile, and results-oriented team player with strong analytical, problem-solving, project management, and interpersonal skills. Proven ability to conceptualize structured projects, innovate around complex problems, and manage multiple programs concurrently.
Communication & Travel: Excellent communication skills for extensive collaboration with global internal/external teams and customers. Periodic travel may be required.

Compensation and Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library (http://www.broadcom.com/videos) and check out our Connected by Broadcom (https://www.broadcom.com/support/resources/video-webinar-library?channel=5c9658f7c1d34eca91c6cc16178e5b1b&video=7d72b04ea50046a394e682fab640ce20) series.

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