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Senior Procurement Officer - Construction & Capital Projects
University of Kansas
Lawrence, KS
The Senior Procurement Officer – Construction & Capital Projects serves as the University's strategic procurement lead for construction, capital improvement, infrastructure, and major…
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Electrical Engineer - Contract and Direct
Kiewit
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…keep some of North America’s most ambitious industrial and infrastructure projects running. Here, engineering isn’t theoretical - it’s built. You’ll design systems that must perform in the…
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Kansas City, KS
- $100,000 USD / year
We are hiring a Lead Mechanical Engineer to support our Industrial team. This position is critical to delivering safe, efficient, and resilient EPC and Design build projects across our…
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Mechanical Engineer - HVAC/Plumbing - Data Centers Job Details | Black & Veatch Family of Companies
Black & Veatch
Overland Park, KS
Mechanical Engineer - HVAC/Plumbing - Data Centers
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…ever-evolving world. With over 100 years of innovation in sustainable infrastructure and our expertise in engineering, procurement, consulting and construction, together we are building a…
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Senior Pursuit Coordinator Job Details | Black & Veatch Family of Companies
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Staff Reg Mechanical Engineer- Conventional Generation
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Software Engineer, Systems ML
Meta
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Meta is seeking a Software Engineer to join our Systems ML Engineering team, focused on building and optimizing the machine learning infrastructure that powers Meta's products at massive…
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Senior Data Engineer
Highmark Health
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…design, development, and maintenance of the organization's data infrastructure, ensuring the efficient and reliable flow of data across various systems. This position is responsible for…
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Solutions Architect - Nutanix Database Service
Nutanix
Topeka, KS
Experience: 5+ years of experience in a customer-facing pre-sales technical role (Solutions Architect, Systems Engineer, or Database Specialist Architect) within an enterprise software,…
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Senior Cybersecurity Architect (Cloud)
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Lead complex platform changes and escalations while sharing implementation, tuning, and support work with the Cloud Security Engineer.
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General Engineer - Direct Hire - SME
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Vicksburg, MS
- $118,204 to $145,483 USD / year
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UA
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U.S. Army Corps of Engineers
Walla Walla, WA
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Senior Quantum Information Engineer
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ERSNETA Electrical Testing Technician SIGNON UP TO $10K
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ERSNETA Electrical Testing Technician SIGNON UP TO $10K
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BINGHAMTON, NY
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ERSNETA Electrical Testing Technician SIGNON UP TO $10K
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ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
BUFFALO, NY
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ERSNETA Electrical Testing Technician SIGNON UP TO $10K
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ALBANY, NY
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Added 24 mins ago
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ERSNETA Electrical Testing Technician SIGNON UP TO $10K
Vertiv Corporation
ALBANY, NY
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Closed listing

Broadcom

Advanced Package Technology Engineer

Fort Collins, CO, United States

This opening has closed.

The original listing is kept below for reference.

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Job details

Posting language: English
Posted: Nov 2, 2026

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Original job description

Archived listing. The details below describe a past opening.

USA-CA San Jose Innovation Drive

USA-Colorado-Fort Collins-4380 Ziegler Road

Full time

R027541

Please Note:

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If you already have a Candidate Account, please Sign-In before you apply.

Job Description:

Role Overview

As a key member of the Worldwide (WW) ASIC Product Development team, you will collaborate closely with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers. You will lead the development of cost-effective, high-performance, advanced custom packaging solutions that meet stringent signal integrity, thermal, structural reliability, design rule, and project schedule requirements.

With 2.5D and 3D technologies pushing the boundaries of modern packaging, you will play a pivotal role in driving cutting-edge architectures to meet future customer and product demands.

Key Responsibilities

Technology Leadership: Serve as the subject matter expert in 2.5D and 3D advanced packaging technologies, engaging with current and future customers to define needs, consolidate requirements, and drive unified solutions.
Partner & Program Management: Lead the identification, development, and qualification of advanced packaging solutions, overseeing program management with external assembly and memory partners to define technology and quality requirements.
Cross-Functional Collaboration: Interface seamlessly with internal technical teams - including Design Integration, Package Design, and Test Development - as part of a dynamic cross-functional team.
NPI & Sourcing Support: Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps, while driving alternate sourcing and qualification initiatives.

Candidate Qualifications & Requirements

Education & Experience: Ph.D./ Master’s degree in Mechanical, Electrical, or Electronics Engineering, with 10+ years of relevant experience.
Packaging Expertise: Proven track record in developing cost-effective, high-performance (optimized for speed, density, pin count, thermal performance, and reliability) single- and multi-chip solutions.
Substrates & Interposers: Experience with large, complex, custom, and fine-pitch flip-chip packaging solutions utilizing advanced multi-layer ceramic/organic substrates and interposers, as well as wafer-level packaging solutions.

Specific Qualifications

Advanced Packaging: 6+ years of hands-on experience in 2.5D / 3D package development and heterogeneous integration.
Process & Materials Know-How: In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes, alongside materials selection, supplier evaluation, BOM definition, and thermal-mechanical interactions.

Additional Competencies

Technical Skills:
Comprehensive knowledge of prevailing and emerging silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards/quality systems.
Hands-on experience using thermal and mechanical modelling tools, alongside substrate/PCB design CAD tools (e.g., APD, AutoCAD, SolidWorks) for design optimization.
Solid understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
Soft Skills: A self-driven, flexible, agile, and results-oriented team player with strong analytical, problem-solving, project management, and interpersonal skills. Proven ability to conceptualize structured projects, innovate around complex problems, and manage multiple programs concurrently.
Communication & Travel: Excellent communication skills for extensive collaboration with global internal/external teams and customers. Periodic travel may be required.

Compensation and Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library (http://www.broadcom.com/videos) and check out our Connected by Broadcom (https://www.broadcom.com/support/resources/video-webinar-library?channel=5c9658f7c1d34eca91c6cc16178e5b1b&video=7d72b04ea50046a394e682fab640ce20) series.

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