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Sr. Radio Frequency (RF) Engineer
The Aerospace Corporation
Kirtland AFB, NM
Support program reviews, design, development, test, and transition-to-operations efforts
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Propulsion Systems Engineer
The Aerospace Corporation
Los Angeles AFB, CA · Cape Canaveral AFS, FL
The Launch Systems, Operations, and Development team within the Launch Systems Division is seeking a well-qualified individual with demonstrated leadership and exceptional communication…
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In this role, you will actively participate in all phases of ground system development to ensure operationally dominant space capabilities are delivered at the speed of warfighting…
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Senior Backend Software Engineer
Kforce
Brooklyn, NY
- $49 to $59 USD / hour
We're looking for an experienced Senior Backend Software Engineer to help build and improve a high-scale platform supporting machine learning applications in production. This is a hands-on…
Added 3 mins ago
Software Engineer Internship – AI Platform Team
Wellmark, Inc.
Des Moines, IA
Why choose an internship with Wellmark? We strive to offer meaningful work that supports your professional development and creates value for the team. During Wellmark’s 2027 Summer…
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Installation Technician II
AVI-SPL
Cleveland, OH
- $23.07 to $29.81 USD / hour
Test point to point cabling and functionality of systems
Added 4 mins ago
A
Installation Technician II
AVI-SPL
Cleveland, OH
- $23.07 to $29.81 USD / hour
Test point to point cabling and functionality of systems
Added 4 mins ago
A
Installation Technician II
AVI-SPL
Chelmsford, MA
- $27.89 to $36.06 USD / hour
Test point to point cabling and functionality of systems
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Project Engineer
AVI-SPL
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…delivering solutions that exceed customer expectations. As a Project Engineer, you will build your skills while ensuring our delivery aligns with the project goals, scope, and requirements.…
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Installation Technician III
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Wixom, MI
Test point to point cabling, functionality of systems, code for control and DSP systems – field load as necessary
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Staff Electronic Design Engineer
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Added 5 mins ago
Senior Electrical Engineer (Power & Mixed-Signal)
Anduril Industries
Costa Mesa, CA
Anduril is seeking an experienced Electrical Engineer based in Costa Mesa, CA to develop and test cutting edge electronics for avionics propulsion systems. We are looking for a self-starter…
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Co-op - Full-Stack Life Sciences Engineer
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Labcorp is seeking a Full-Stack Life Sciences Software Engineer Co-op to join our Office of the Chief AI Officer (CAIO) Team located in Burlington, NC or Durham, NC with the flexibility of…
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Senior Project Implementations Manager - 1st Shift - Travel
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Experience in staff management and development, including solid track record of mentoring Project Managers
Added 7 mins ago
Senior Project Implementations Manager - 1st Shift - Travel
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Fire Alarm Specialist
Denton Independent School District
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…interior and exterior bleacher systems as well as biannual engineer inspections of same per NFPA Code 102,…
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DevSecOp Engineer
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Added 14 mins ago
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Mechanical Engineer
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Mechanical Design Engineer
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Quality Engineer
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Senior Software Engineer
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Avago Technologies U.S. Inc.

Advanced Package Technology Engineer

United States

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Job details

Apply by: Apr 16, 2027
Posting language: English
Posted: Nov 2, 2026

Original job description

Please Note:

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Job Description:

Role Overview As a key member of the Worldwide (WW) ASIC Product Development team, you will collaborate closely with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers. You will lead the development of cost-effective, high-performance, advanced custom packaging solutions that meet stringent signal integrity, thermal, structural reliability, design rule, and project schedule requirements.

With 2.5D and 3D technologies pushing the boundaries of modern packaging, you will play a pivotal role in driving cutting-edge architectures to meet future customer and product demands.

Key Responsibilities

Technology Leadership: Serve as the subject matter expert in 2.5D and 3D advanced packaging technologies, engaging with current and future customers to define needs, consolidate requirements, and drive unified solutions.
Partner & Program Management: Lead the identification, development, and qualification of advanced packaging solutions, overseeing program management with external assembly and memory partners to define technology and quality requirements.
Cross-Functional Collaboration: Interface seamlessly with internal technical teams - including Design Integration, Package Design, and Test Development - as part of a dynamic cross-functional team.
NPI & Sourcing Support: Support new design wins, New Product Introduction (NPI), and high-volume manufacturing ramps, while driving alternate sourcing and qualification initiatives.

Candidate Qualifications & Requirements

Education & Experience: Ph.D./ Master’s degree in Mechanical, Electrical, or Electronics Engineering, with 10+ years of relevant experience.
Packaging Expertise: Proven track record in developing cost-effective, high-performance (optimized for speed, density, pin count, thermal performance, and reliability) single- and multi-chip solutions.
Substrates & Interposers: Experience with large, complex, custom, and fine-pitch flip-chip packaging solutions utilizing advanced multi-layer ceramic/organic substrates and interposers, as well as wafer-level packaging solutions.

Specific Qualifications

Advanced Packaging: 6+ years of hands-on experience in 2.5D / 3D package development and heterogeneous integration.
Process & Materials Know-How: In-depth understanding of advanced silicon fabrication, bumping, interposer, substrate, and assembly processes, alongside materials selection, supplier evaluation, BOM definition, and thermal-mechanical interactions.

Additional Competencies

Technical Skills:
Comprehensive knowledge of prevailing and emerging silicon, package, and substrate technologies, design rules, failure analysis techniques, materials, equipment, and industry standards/quality systems.
Hands-on experience using thermal and mechanical modelling tools, alongside substrate/PCB design CAD tools (e.g., APD, AutoCAD, SolidWorks) for design optimization.
Solid understanding of advanced-node silicon fabrication, PCB technologies, and board assembly processes.
Soft Skills: A self-driven, flexible, agile, and results-oriented team player with strong analytical, problem-solving, project management, and interpersonal skills. Proven ability to conceptualize structured projects, innovate around complex problems, and manage multiple programs concurrently.
Communication & Travel: Excellent communication skills for extensive collaboration with global internal/external teams and customers. Periodic travel may be required.

Compensation and Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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More about this job

Skills

Assembly
Packaging
Leadership
Program management
Collaboration
Quality control systems
Printed circuit boards
Autodesk AutoCAD
Dassault Systemes SolidWorks
Problem solving
Project management
Interpersonal skills
Communication skills

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