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Added 18 hours ago
Sr Manager / Dep Director Quantum Reliability
GLOBALFOUNDRIES U.S. INC.
NY
GlobalFoundries is a leading full-service semiconductor foundry providing design, development, and manufacturing services to customers worldwide. GF Labs and Quantum Technology Solutions…
Added 4 days ago
Information Technology Director (Data Platform & AI Engineering)
Graphic Packaging International, LLC
Atlanta, GA
Reporting to the VP, Data & AI, the Director, Data Platform & AI Engineering will lead Graphic Packaging’s data platform and AI engineering function, building and operating the governed…
Added 6 days ago
Director Quality, Reliability & I/O
PsiQuantum
NY
The Director of Quality, Reliability and I/O will lead the teams and foundry partnerships responsible for quality, reliability, and advanced interconnect technologies across PsiQuantum’s…
Added 6 days ago
Operations Project Management Manager (OPM M2)
Northrop Grumman
Apopka, FL
Northrop Grumman’s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge…
Added 6 days ago
Manager Programs 3
Northrop Grumman
Linthicum Heights
As a Senior Program Manager, you will lead complex, fast-paced programs focused on development, prototyping, and maturation of advanced packaging technologies and microelectronics products.…
Added 7 days ago
Manager Programs 3
CORP-Corporate Office
United States
As a Senior Program Manager, you will lead complex, fast-paced programs focused on development, prototyping, and maturation of advanced packaging technologies and microelectronics products.…
Added 7 days ago
Supplier Commodity Manager
Cisco Systems, Inc.
San Jose, CA
As Commodity Manager of Silicon Sourcing & Supplier Management, this role supports Cisco’s global strategy across Foundry, OSAT and Substrates, supporting Silicon One, Cisco’s flagship…
Added 10 days ago
Cybersecurity and Compliance Senior Manager or Director, Texas Institute for Electronics
The University of Texas at Austin
AUSTIN, TX
TIE is looking for Manager or Director of Cybersecurity Compliance to work on site in Austin, TX, and support the strategy and introduction of products based on unique and highly…
Added 12 days ago
CryoCMOS Design Director, Quantum
GLOBALFOUNDRIES U.S. INC.
United States
…differentiated integrated circuit solutions for quantum and other advanced applications. The manager will provide technical direction, organizational leadership, and execution ownership…
Added 12 days ago
Director Purchasing- Foundry and Advanced Packaging
Advanced Micro Devices, Inc
Austin, TX
Coordinate the management and spend of AMD’s foundry suppliers (wafer or post fab / advanced packaging) reporting directly to the Sr. Director of Procurement.
Added 12 days ago
Principal/Senior Principal MMIC RFIC Design Engineer
Northrop Grumman
Baltimore
Support the development of MMIC and RFIC products for advanced, cutting-edge systems and applications as part of an industry-leading, technically broad, foundry-independent design team.
Added 12 days ago
Principal/Senior Principal MMIC RFIC Design Engineer
CORP-Corporate Office
United States
Support the development of MMIC and RFIC products for advanced, cutting-edge systems and applications as part of an industry-leading, technically broad, foundry-independent design team.
Added 13 days ago
Manager Programs 2 - Advanced Packaging
Northrop Grumman
Apopka
The Northrop Grumman Microelectronics Center is seeking an Advanced Packaging Program Manager, Level 2 to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced…
Added 13 days ago
DF
Application Engineering Director
Diamond Foundry
Bay Area, CA
- $180,000 to $270,000 USD / year
Diamond Foundry is seeking an experienced Director of Application Engineering to lead how our single-crystal diamond is integrated into semiconductor devices, with a focus on advanced…
Added 14 days ago
Manager Programs 2 - Advanced Packaging
CORP-Corporate Office
United States
The Northrop Grumman Microelectronics Center is seeking an Advanced Packaging Program Manager, Level 2 to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced…
Added 14 days ago
AI Engineering Manager
Solstice Advanced Materials
Morris Plains, NJ
As an AI Engineering Manager at Solstice, you will play a pivotal role in driving AI initiatives across various business functions using multiple technology platforms. You will translate…
Added 14 days ago
Director Design Engineering
MIPS Holding Inc
United States
We are seeking an experienced and highly accomplished Director of Design Engineering to lead the development and execution of complex SoC programs across advanced semiconductor…
Added 17 days ago
Director, Global ASIC Capacity Planning and Strategy
Cisco Systems, Inc.
San Jose, CA
As Director, Global Capacity Planning & Strategy, you will build and implement the long-term capacity strategy that supports Cisco's Silicon One business around the world. Working across…
Added 17 days ago
ST
Sr. Director Business Development - Quantum Foundry
SkyWater Technology
Bloomington, MN
- $194,640 to $243,300 USD / year
The Senior Director, Quantum Foundry Business is the commercial leader responsible for defining and executing SkyWater's Quantum Foundry growth strategy. This role drives customer…
Added 18 days ago
Director, Business Operations
onsemi
Scottsdale, AZ · San Jose, CA
Partner across Product Development, Engineering, Manufacturing, Quality, and Supply Chain to align product roadmaps, qualifications, transfers, packaging, tooling, and test readiness with…
Added 20 days ago
Cybersecurity Compliance Manager
Insight Global
Austin, TX
…unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies. Their mission is to advance the state-of-the-art in…
Added 24 days ago
T
Account Manager/Technical Manager
TSMC
San Jose, CA
- $131,500 to $187,000 USD / year
The Account Manager serves as a primary commercial and operational interface between TSMC North America and its advanced-node and 3DIC customers, managing the business relationship across…
Added 24 days ago
Panel Packaging Technology Enablement Director
Applied Materials, Inc
Santa Clara, CA · Austin, TX
Applied Materials is building the equipment, process, and integration capability that makes panel-level packaging a production-ready scaling path for AI accelerators and high-performance…
Added 24 days ago
Panel Packaging Technology Enablement Director
Applied Materials
Santa Clara, CA · Austin, TX · Santa Clara · Austin
Applied Materials is building the equipment, process, and integration capability that makes panel-level packaging a production-ready scaling path for AI accelerators and high-performance…
Added 25 days ago
ST
Director of Advanced Packaging Process Engineering
SkyWater Technology Foundry, Inc.
Kissimmee, FL
- $184,400 to $276,600 USD / year
Our Process Engineering Director is accountable to ensure the Process Engineering Team is continuously optimizing our manufacturing processes to be highly efficient with high yields and low…

Applied Materials, Inc

Panel Packaging Technology Enablement Director

Santa Clara, CA, United States
Austin, TX, United States

$176,000.00 - $242,000.00 · Full-time

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Job details

Pay: $176,000.00 - $242,000.00
Job type: Full-time
Posting language: English
Posted: Oct 16, 2026

Original job description

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Salary:

$176,000.00 - $242,000.00

Location:

Austin,TX, Santa Clara,CA You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible - while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Applied Materials is building the equipment, process, and integration capability that makes panel-level packaging a production-ready scaling path for AI accelerators and high-performance computing. The Director, Panel Packaging Technology Enablement leads the team that develops and validates panel process solutions, from core substrate formation through build-up and interconnect. The role combines technical leadership of panel integration programs, direct engagement with customers and ecosystem partners, and management of a multidisciplinary engineering team. The Director sets the technical direction for panel enablement within the business unit and represents Applied Materials across the substrate, OSAT, foundry, and materials ecosystem.

Key Responsibilities

Technology Development and Integration

Defines and executes the panel technology enablement roadmap, translating AI package architecture requirements (package size, I/O density, power delivery, warpage, and reliability) into unit process and integration targets for panel technology. Plans integrated process flows spanning core formation, through-glass via fabrication and metallization, fine-line RDL and build-up layers, and panel-scale interconnect.
Leads the most complex integration programs from concept through customer transfer, including customized process development. Originates, designs, and analyzes engineering experiments within safety guidelines, using DOE and statistical methods to establish process windows and resolve root cause on multi-process integration issues.
Identifies gaps in the Applied portfolio and provides direct feedback to business unit and product division leaders on process and hardware improvements needed to meet customer roadmaps. Drives coordination across product divisions so panel solutions are delivered as integrated packages rather than individual tools.

Customer Engagement

Serves as the primary technical lead to strategic customers on panel packaging, including substrate manufacturers, OSATs, foundries, and accelerator designers. Positions new Applied technologies, negotiates process specifications and service offerings, and owns delivery of solutions that address high-value customer problems.
Establishes and oversees joint development programs, evaluations, and beta-site activities at customer development and manufacturing sites. Defines demo conditions, reviews results, and ensures learnings are captured and applied across the portfolio.
Makes executive-level presentations to customer and partner leadership. Works with account teams to strengthen customer satisfaction and Applied’s technical standing in advanced packaging.

Industry Collaboration and Ecosystem Development

Builds and manages strategic partnerships with materials suppliers, substrate makers, equipment partners, research institutes, and universities to close ecosystem gaps in panel processing, including glass handling, panel-scale metrology, materials compatibility, and standardization of panel formats.
Represents Applied Materials on industry consortia, standards bodies, and technical committees. Publishes and presents at leading packaging conferences and journals, and contributes to Applied’s external voice on panel-level packaging as a scaling path for AI systems.

Team Leadership and Management

Builds, leads, and develops a multidisciplinary team of process, integration, and applications engineers. Sets team priorities, owns resource and budget planning, and aligns team output with business unit objectives measured by revenue growth, key customer penetration, market share, and time to market.
Recruits and retains strong technical talent, mentors engineers at all levels, and fosters a culture of disciplined execution, data-driven decisions, and cross-functional collaboration. Creates mechanisms to track program progress, communicate issues, and draw resources from multiple business units and functions.
Contributes to intellectual property strategy and leads the team in generating patents and publications in panel technology.

Qualifications

Required

Ph.D. in chemistry, materials science, chemical engineering, electrical engineering, physics, or a related field with 12+ years of experience in semiconductor packaging, substrate, or interconnect technology development (or M.S. with 15+ years).
Hands-on technical depth in advanced packaging integration, such as 2.5D/3D packaging, high-density substrates, fan-out, or build-up processing, with working knowledge of PVD, plating, etch, lithography, and dielectric processes.
Demonstrated record of leading engineering teams and delivering complex technology programs to customers or into high-volume manufacturing.
Experience presenting to and negotiating with senior customer and partner leadership.
Track record of patents, publications, and conference presentations.

Preferred

Direct experience with panel-format processing, glass core substrates, through-glass vias, or fine-line RDL at sub-5 µm line/space.
Familiarity with AI accelerator and HPC package architectures, including chiplet integration and HBM co-packaging.
Established relationships across the Asia-Pacific substrate and OSAT ecosystem and participation in industry consortia.
Experience managing joint development agreements and multi-party technical programs.

Competencies Functional Knowledge: Recognized internally and externally as an expert in advanced packaging, with broad expertise in emerging panel processes, materials, and integration schemes. Business Expertise: Influences internal and external business decisions, including partner strategy, customer roadmaps, and industry standards that affect Applied’s position in advanced packaging. Leadership: Leads highly visible, multidisciplinary teams and programs; provides technical and organizational direction across business units. Problem Solving: Anticipates and solves complex integration problems that lack an established solution in the industry. Impact: Shapes business unit direction through the development of new process solutions and integrated product offerings. Interpersonal Skills: Negotiates with senior management, customers, partners, and suppliers to influence technical and commercial decisions.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 25% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

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More about this job

Skills

Packaging
Architecture regulations
Presentation skills
Leadership
Customer service
Research
Team leadership
Budget management
Materials science
Chemical engineering
Electrical engineering
Problem solving
Interpersonal skills
Sales

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