Jobs in the United States

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J
Product Marketing Manager
Santa Clara, CA
- $155,544 to $200,277 USD / year
The role requires in-office presence three days per week, generally Tuesday through Thursday.
Added 1 hour ago
Reliability Engineer - Fixed (53306)
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…Phillips Chemical. From medical supplies and electronics to food packaging and cosmetics, we create the building blocks for more than 70,000 consumer and industrial…
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Field Service Engineer – Mechanical & Electro-Mechanical Systems
Added 1 hour ago
Field Service Engineer
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Austin, TX
Field Service Engineer – Mechanical & Electro-Mechanical Systems
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Process Engineer
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Austin, TX
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Added 1 hour ago
I
Intel Foundry Product Yield Development Engineer
Intel
Austin, TX
- $141,910 to $269,100 USD / year
You must possess the below minimum qualifications to be initially considered for this position
Added 2 hours ago
Broadcast Engineer III
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Space Coast, FL
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Principal Backend / Fullstack Engineer (E-commerce & Platform Integrations)
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Remote, United States
…sustainability to all stages of product development, from R&D to packaging. Ultimately, we strive to promote absolute skin health by empowering all who seek authentic, natural, and ageless…
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Microsoft Power Platform Engineer
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Engineer controlled ALM using Power Platform Pipelines and approved CI/CD tooling to prevent unapproved direct production changes, including solution packaging, deployment configuration,…
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Pricing & Monetization Associate
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NY
This role is a hybrid / in-office role, with approximately three days per week in our New York City Office
Added 4 hours ago
Pricing & Monetization Associate
MongoDB
NY
This role is a hybrid / in-office role, with approximately three days per week in our New York City Office
Added 4 hours ago
IC
Substrate Packaging Research and Development Engineer
Intel Corporation
AZ
- $133,800 to $188,890 USD / year
As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and…
Added 4 hours ago
Molding Department Manager
Summit Polymers
Sturgis, MI
Supports new launches with samples, optimizing processes, end of arm tooling, internal packaging, and justifying new equipment
Added 4 hours ago
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Senior Platform Software Engineer
Oracle
Nashville, TN
- $87,800 to $209,500 USD / year
Software Engineer - OCI User Experience Engineering Platform
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Customer Service Rep
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…coordination of warehouse duties, including inventory, creating packaging slips and reports, and fulfilling customer orders. If you’re excited about the challenge of working for a rapidly…
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Design Engineering Manager
The businesses of Merck KGaA, Darmstadt, Germany
Austin, TX
…support new product development, configure-to-order (CTO), engineer-to-order (ETO), and product sustaining…
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Design Engineering Manager
The businesses of Merck KGaA, Darmstadt, Germany
Chandler, AZ
…support new product development, configure-to-order (CTO), engineer-to-order (ETO), and product sustaining…
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AI Engineer – Generative AI & Agentic AI
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United States
The AI Engineer works closely with AI Architects, software engineers, data
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Controls Engineer
Colgate-Palmolive Company
Tonganoxie, KS
2+ years of controls experience within a high-speed consumer goods (CPG), packaging, or food/beverage manufacturing facility.
Added 5 hours ago
TI
Senior Staff SI/PI Engineer
TYLsemi, Inc.
San Jose, CA
- $204,000 to $250,000 USD / year
As an SI/PI, Package and Power Delivery Engineer at Tylsemi, you will own signal integrity, power integrity, and package/PDN co-design across chip, package, and board interfaces. You will…
Added 6 hours ago
Advanced Packaging Development Engineer
Apple
Santa Clara, CA
Apple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In…
Added 6 hours ago
Principal Mechanical Engineer
Northrop Grumman
Plymouth
citizen and must have the ability to obtain a DoD security clearance to a level of Secret
Added 6 hours ago
OM
Quality Control and Production Engineer
Oriental Motor U.S.A. Corporation
Torrance, CA
- $75,000 to $82,500 USD / year
…leaders in their industries from Medical to Semiconductor, Packaging, Conveyors, Robots, Automated Guided Vehicles, and everything in…
Added 6 hours ago
THAAD Field Engineer (Secret Clearance)
Akima, LLC
Huntsville, AL
Must possess an active security clearance SECRET level or higher
Added 6 hours ago
Field Engineer (Clearance Required)
Akima, LLC
El Paso, TX
Must possess an active security clearance SECRET level or higher

Advanced Packaging Development Engineer

Santa Clara, CA, United States

The base pay range for this role is between $150,400 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.

Apply on jobs.apple.com About employer

Applications open in a new tab.

Job details

Pay: The base pay range for this role is between $150,400 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.
Education: Bachelor’s degree
Posting language: English
Posted: Nov 10, 2026

Original job description

Summary Apple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies - incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).

You will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.

Description In this role, you will be responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.

Responsibilities

Develop Advanced Packaging Architectures: Lead the definition, development, and qualification of advanced packaging technologies featuring hybrid bonding, fine-pitch microbumps, interposers, and TSVs. Define & Execute Test Vehicles: Design experimental test vehicles, establish packaging design rules, and lead characterization to validate novel interconnect concepts and build confidence for product integration. Manage Chip-Package Interaction & Reliability: Assess CPI risks, correlate mechanical and thermal stress behaviors, and partner with failure analysis teams to resolve yield, material, and structural challenges. Drive Cross-Functional Co-Optimization: Collaborate across architecture, silicon design, SI/PI, and thermal teams to evaluate holistic system trade-offs across performance, power, reliability, and cost. Lead External Technology Partners: Direct foundry and OSAT partners on technology roadmaps, process capability targets, development schedules, and high-volume manufacturing ramp.

Minimum Qualifications Bachelor’s degree required

Preferred Qualifications Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs). Solid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows. Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms. Broad systems mindset with the ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints. Experience utilizing layout, physical design, or modeling tools alongside engineering data analysis. Proven track record collaborating with and driving external foundries, OSATs, or material vendors. Excellent communication and collaboration skills across cross-functional hardware teams. Education & Experience Degree: B.S., M.S., or Ph.D. in Physics, Materials Science, Electrical Engineering, Mechanical Engineering, Computer Engineering, or a related technical discipline.

Pay & Benefits At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $150,400 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

EEO Statement Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

Accessibility At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here - in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

Learn about accessibility in Apple’s workplace

Learn about reasonable accommodations for job applicants

Application Deadline Apple accepts applications to this posting on an ongoing basis.

Apply on jobs.apple.com About employer

More about this job

Skills

Packaging processes
Packaging
Assembly
Data analysis
Communication skills
Collaboration
Materials science
Electrical engineering
Mechanical engineering
Computer engineering

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Work requirements

Jobs in the United States