Engineer Circuit Design 3 - 3056332

Job#: 3056332 Job Description: Engineer Circuit Design 3 Location: Cincinnati, Ohio (On-site) Role Overview A professional opportunity is available for a qualified circuit designer to join our organization in Cincinnati, Ohio. This position involves supporting the design and delivery of high-reliability circuit card assemblies. The successful candidate will collaborate across electrical, mechanical, manufacturing, and signal integrity disciplines to transform complex electrical architectures and schematics into robust, production-ready printed circuit board solutions. This role requires a collaborative, team-oriented professional with a commitment to technical excellence and continuous learning. Key Responsibilities - Execute the placement and routing of complex, high-density, multi-layer printed circuit boards, including high-speed digital, RF, mixed-signal, and power circuits. - Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized layouts that meet performance, reliability, and manufacturability requirements. - Generate and maintain complete fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for partners. - Apply current industry standards and criteria in the design and verification of printed wiring boards and circuit card assemblies. - Collaborate with engineering teams to address layout-related design challenges involving signal integrity, power integrity, thermal management, and packaging. - Support and perform Design for Manufacturing, Design for Assembly, and Design for Test reviews using automated and manual checks to improve yield. - Work with fabrication and assembly suppliers to incorporate manufacturing capabilities and constraints into physical designs. - Support library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows. - Manage layout tasks independently from concept through fabrication data release to support schedule and technical requirements. - Lead advanced layout efforts using High-Density Interconnect, microvias, via-in-pad, backdrilling, and specialized substrate materials. Required Qualifications Education: A Bachelor of Science, Master of Science, or PhD in a relevant engineering discipline is required. Experience: Candidates must possess a minimum of 8 to 12 years of experience performing engineering and layout of printed circuit boards, with extensive utilization of Xpedition software. Technical Skills: Experience with the layout of multi-layer, high-density printed circuit boards and circuit card assemblies, including high-speed digital, RF, and mixed-signal circuits. Demonstrated knowledge of fabrication and assembly processes, industry standard criteria, and the generation of technical documentation packages is required. Preferred Qualifications - Prior experience with programs that demand stringent reliability, documentation, and traceability requirements. - Demonstrated expertise in advanced, high-density, multi-layer printed circuit boards combining RF, high-speed digital, and high-power circuit sections. - Knowledge of process workflows and library management, including creation and governance of symbols, footprints, and reusable elements. - Ability to translate complex mechanical boundaries and electrical constraints into optimized physical layouts across multiple boards or modules. - Deep domain knowledge of high-reliability aerospace hardware criteria or comparable industry standards demonstrating equivalent rigor. Everforth Apex is a world-class IT services company that serves