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Added 3 mins ago
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Critical Environment Electrical Engineer
Microsoft
AZ · Phoenix, AZ · Goodyear, AZ · Phoenix · Goodyear
- $102,100 to $202,200 USD / year
…services. As a CO+I Data Center Critical Environment Electrical Engineer, you will perform a key role in delivering the core infrastructure and foundational technologies for Microsoft's…
Added 3 mins ago
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Senior Silicon Design Verification Engineer
Microsoft
CA · TX · OR · WA · NC · Mountain View, CA · Austin, TX · Hillsboro, OR · Redmond, WA · Raleigh, NC · Mountain View · Austin · Hillsboro · Redmond · Raleigh
- $119,800 to $261,000 USD / year
We are looking for a Senior Silicon Design Verification Engineer to join the team.
Added 4 mins ago
M
Logic Design Engineer
Microsoft
United States
- $102,100 to $219,200 USD / year
We are looking for a Logic Design Engineer to join the team.
Added 4 mins ago
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Principal Product Engineer
Microsoft
CA · OR · NC · TX · Mountain View, CA · Hillsboro, OR · Raleigh, NC · Austin, TX · Mountain View · Hillsboro · Raleigh · Austin
- $142,800 to $304,200 USD / year
We are looking for a Principal Product Engineer to join the team.
Added 4 mins ago
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Senior Validation Engineer
Microsoft
CA · Mountain View, CA · Mountain View
- $119,800 to $261,000 USD / year
We are looking for a Senior Validation Engineer with expertise in one or more of the following validation domains : functional, electrical, high speed interfaces, memory, power/performance,…
Added 4 mins ago
M
Senior Design Verification Engineer
Microsoft
NC · TX · WA · Raleigh, NC · Austin, TX · Redmond, WA · Raleigh · Austin · Redmond
- $119,800 to $261,000 USD / year
…worldwide and we are looking for a Senior Design Verification Engineer to help achieve that…
Added 4 mins ago
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Senior Mechanical Engineer, AI Systems
Microsoft
CA · Mountain View, CA · Mountain View
- $119,800 to $261,000 USD / year
The Senior Mechanical Engineer will contribute to the design and deployment of future high density, liquid-cooled systems in Azure datacenters.
Added 11 mins ago
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Senior Software Engineer- AI Agents
Microsoft
WA · CA · NY · Redmond, WA · Mountain View, CA · Redmond · Mountain View · New York
- $119,800 to $261,000 USD / year
…governing AI agents at scale. We are looking for a Senior Software Engineer who is passionate about building secure, reliable, and highly scalable distributed systems and helping shape the…
Added 12 mins ago
UG
Full Stack Software Engineer
UnitedHealth Group
Eden Prairie, MN
- $72,800 to $130,000 USD / year
Added 17 mins ago
Software Engineer, Associate - Business Finance Technology
Blackstone Administrative Services Partnership
NJ
We're looking for a hands-on software engineer to help build the platforms that power finance and fund operations across Blackstone. You'll develop and support features within our…
Added 19 mins ago
TT
Lead Product Engineer
True Talent Solutions Partners
New York, NY
- $225,000 to $275,000 USD / year
- Work directly with internal users to understand workflows, gather requirements, and rapidly test prototypes.
Added 23 mins ago
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Software Dev Engineer II - AMZ27051.1
Amazon
East Palo Alto, CA
- $165,200 to $223,600 USD / year
Design, develop, implement, test, and document embedded or distributed software applications, tools, systems and services. Translate functional requirements into robust, efficient,…
Added 23 mins ago
SUPERVISOR
Space and Naval Warfare Systems Command
Point Loma Complex, CA
Added 23 mins ago
M
Software System Test Engineer
ManpowerGroup
Santa Clarita, CA
- $55 to $65 USD / hour
We are seeking an experienced Software Systems Test Engineer to support R&D and engineering initiatives. The ideal candidate will have strong Python programming skills, hands-on system and…
Added 23 mins ago
Senior PCB Layout and Design Engineer
Butler America
Canoga Park, CA
The Senior PCB Layout and Design Engineer leads the physical design and layout of complex printed circuit boards, translating electrical schematics and engineering requirements into…
Added 23 mins ago
F-22 Systems Engineer (Loads) - Level 2
Lockheed Martin
Edwards AFB, CA
…develop and maintain technical documentation, including defining test plans and monitoring data during flight tests to evaluate structural performance. Candidate will be responsible for…
Added 24 mins ago
Opto-Mechanical Engineer, Amazon Leo for Government
Amazon
NORTHRIDGE, CA
…customers (such as government agencies). The Opto-Mechanical Engineer will play an important role in the team delivering innovative and fast-paced design and analysis for both space and…
Added 24 mins ago
RF Engineer, Amazon Leo Government, Amazon Leo Government
Amazon
Northridge, CA
The RF/Microwave Engineer will focus on the design of the various RF and Microwave circuit blocks in the range of Ka, L, and S bands. They will be expected to lead a variety of tasks, from…
Added 24 mins ago
ES
Material Handler I
Empirical Systems Aerospace, Inc.
San Luis Obispo, CA
- $20 to $25 USD / hour
At ESAero, we don’t just build products, we engineer solutions that propel
Added 24 mins ago
Industrial Facility Security Officer (FSO)
Empirical Systems Aerospace, Inc.
San Luis Obispo, CA
Added 24 mins ago
Deputy Supply Chain Director
Empirical Systems Aerospace, Inc.
San Luis Obispo, CA
At ESAero, we don’t just build products, we engineer solutions that propel
Added 24 mins ago
Additive Manufacturing Supervisor
Empirical Systems Aerospace, Inc.
San Luis Obispo, CA
…engineering services. At ESAero, we don’t just build products, we engineer solutions that propel the aerospace industry…
Added 24 mins ago
ES
Production Technician II
Empirical Systems Aerospace, Inc.
San Luis Obispo, CA
- $26 to $29 USD / hour
At ESAero, we don’t just build products, we engineer solutions that propel the aerospace industry forward.
Added 24 mins ago
Senior DevOps Engineer
Abbott
Pleasanton, CA
We are seeking a highly skilled and experienced Senior DevOps Engineer to design, implement, and optimize scalable DevOps solutions that support the build, release, and deployment of modern…
Added 24 mins ago
Thermal Engineering - Lab Engineer
Amgen
Thousand Oaks, CA
This Engineer position is part of the Thermal Engineering group within Combination Product Operations. The successful candidate will support laboratory operations by performing and…

Advanced Micro Devices, Inc

Principal Semiconductor Packaging Technologist – Customer Solutions

San Jose, CA, United States

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Job details

Apply by: Nov 10, 2027
Posting language: English
Posted: Nov 10, 2026

Original job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.

Role Summary Advanced packaging is at the center of everything happening in semiconductors right now - AI accelerators, next-generation FPGAs, embedded SoCs, and custom ASICs are all pushing the limits of what packaging technology can deliver. AECG Packaging is where that work gets done.

We are looking for a Principal Packaging Integration Engineer who can do two things exceptionally well: drive technically sound packaging architecture decisions and be the trusted engineering partner our customers rely on to bring those decisions to life.

This is not a support role. You will own your programs - technically and commercially - from architecture through qualification, pulling together design, process, quality, test, and supply chain into decisions that are smart, manufacturable, and on schedule.

If you are a seasoned packaging engineer who has outgrown pure technical execution and wants a role where your judgment, relationships, and technical depth all matter equally - this was written for you.

Key Responsibilities

Drive packaging architecture decisions and IC-PKG-PCB co-design for FPGA, embedded SoC, and custom ASIC programs spanning 2.5D/3D, OPC, and MOP technologies.
Lead DFM and DFMEA reviews and packaging supply qualification, partnering with OSAT/substrate suppliers on manufacturable, reliable, application-ready solutions.
Serve as the primary customer-facing contact for assigned programs - representing the packaging organization and translating customer requirements into internal technical direction.
Organize and lead cross-functional task forces across silicon design, packaging, SI/PI, thermal-mechanical, quality and reliability test, and supply chain to resolve issues, align decisions, and keep programs on schedule.
Proactively fill gaps between functional groups and track commitments to genuine closure.
Build durable, trusted relationships with customers and internal partners through responsive, patient, detail-oriented follow-through.

Qualifications

Expert-level experience in semiconductor packaging technology integration, with working knowledge of 2.5D/3D integration, OPC, MOP, and IC-PKG-PCB co-design and co-development.
Strong experience with DFM/DFMEA/PFMEA and packaging supply qualification (OSAT/substrate/materials partners).
Demonstrated experience engaging customers directly and coordinating cross-functional task forces to closure.
Fluent, confident communicator with both engineering teams and customers; detail-oriented, patient, and customer-driven.
Willing to step out to fill gaps between functional groups and drive issues to closure.
Bachelor's or Master's degree in Electrical, Materials, Mechanical, or Semiconductor Engineering, or a related field.

Preferred Skills

Strong knowledge of SoC architecture and critical IP blocks (SerDes, PHYs, memory controllers, I/O subsystems) and how they drive packaging and interconnect requirements.
Familiarity with IC-package-PCB co-design and analysis tools (e.g., Cadence, Synopsys, Ansys, or equivalent EDA platforms).
Familiarity with UCIe (Universal Chiplet Interconnect Express) and other die-to-die/chiplet interconnect standards.
Experience with signal integrity and power integrity (SI/PI) analysis across the package and board interconnect.
Understanding of high-speed I/O interface design considerations at the package level.
Familiarity with DDR/memory interface routing, timing, and packaging constraints.
Experience with power plane and PDN (power delivery network) optimization across silicon, package, and board.
Ability to evaluate design considerations and trade-offs (performance, cost, manufacturability, reliability, schedule) and communicate them clearly to both engineering and customer stakeholders.

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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Skills

Packaging
Supply chain management
Printed circuit boards
Ansys
EDA

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