Jobs in the United States

25+ jobs

Save this search

Added 4 mins ago
C
Senior .NET Full Stack Engineer with C#
Cognizant
Saint Paul, MN
- $86,000 to $99,000 USD / year
Document technical designs, application data flows, integration patterns, and healthcare payer business rules to support knowledge sharing and long-term maintainability.
Added 4 mins ago
C
Senior Full Stack Engineer – .NET & C#
Cognizant
Saint Paul, MN
- $86,000 to $99,000 USD / year
Document technical designs, application data flows, integration patterns, and healthcare payer business rules to support knowledge sharing and long-term maintainability.
Added 4 mins ago
C
Senior Java Full Stack Engineer – Spring Boot & AWS
Cognizant
Saint Paul, MN
- $86,000 to $99,000 USD / year
As a Senior Java Full Stack Engineer – Spring Boot & AWS , you will make an impact by designing and delivering scalable, secure, cloud-based applications using Java, Spring Boot, React, and…
Added 4 mins ago
Senior Network Engineer
Cognizant
Saint Paul, MN
We are seeking an experienced Senior Network Engineer to design, implement, secure, operate, and optimize enterprise data-center, campus, branch, wireless, and hybrid-cloud networks. The…
Added 4 mins ago
Senior Workday Security Engineer
CVS Health
Saint Paul, MN
CVS Health is seeking an experienced Senior Workday Security Engineer to join the HR Technology Workday Security team. This role designs, supports, governs, and optimizes security across…
Added 4 mins ago
Sr. Operations Engineer, AMZL Ops Integration Engineering
Amazon
Minneapolis, MN
Amazon Logistics (AMZL) is looking for an Operations Engineer to join the Ops Integration Engineering (OIE) team. OIE is responsible for bridging the gap between engineering innovation and…
Added 4 mins ago
Senior Cloud Engineer
Eide Bailly
Minneapolis, MN
Strong knowledge of cloud architecture, integration, security, scalability, reliability, governance, and enterprise application design principles.
Added 4 mins ago
Senior Cloud Engineer
Eide Bailly
Minneapolis, MN
Strong knowledge of cloud architecture, integration, security, scalability, reliability, governance, and enterprise application design principles.
Added 4 mins ago
Associate Director, Cyber Operations (Countermeasures)
KPMG LLP
Minneapolis, MN
Establish andmaintain interim controls that reduce exploitability and limit business impactwhile infrastructure and application teams correct underlying weaknesses; Define expiration dates,…
Added 5 mins ago
Engineer II, Google Cloud
PwC
Minneapolis, MN
As a Engineer II, Google Cloud you will contribute to the design, build, testing, and optimization of cloud-native applications on Google Cloud, supporting work across the full software…
Added 9 mins ago
SI
Forward Deployed Engineer Specialists (FDE) (Mid/Senior Level)
Salesforce, Inc.
NY
- $148,500 to $285,800 USD / year
Design agent intelligence: prompts, reasoning, tool calls, and integration with customer systems, leveraging our Agentic AI platform and current LLM techniques.
Added 10 mins ago
Principal Semiconductor Packaging Technologist – Customer Solutions
Advanced Micro Devices, Inc
San Jose, CA
We are looking for a Principal Packaging Integration Engineer who can do two things exceptionally well: drive technically sound packaging architecture decisions and be the trusted…
Added 37 mins ago
Software Engineer – Full Stack (JavaScript & Python)
HTC Global Services Inc
Dearborn, MI
We are seeking a Software Engineer to design, develop, test, and maintain scalable software applications and services. The ideal candidate will have experience in software development,…
Added 40 mins ago
2026 Associate/Electrical Engineer- Gilbert AZ
Military Spouse Jobs & VetJobs
United States
Our Tactical Space Systems Division Integration and Test group is seeking an Electronics Engineer to join our team of qualified and diverse individuals in Gilbert, AZ. You will have the…
Added 57 mins ago
Senior Principal Systems Engineer (Electromagnetic Environmental Effects (E3))
CORP-Corporate Office
United States
Northrop Grumman Aeronautics Systems has an opening for a Senior Principal Systems Engineer (Electromagnetic Environmental Effects (E3)) to join our team of qualified, diverse individuals…
Added 57 mins ago
Principal Systems Engineer (Electromagnetic Environmental Effects (E3))
CORP-Corporate Office
United States
Northrop Grumman Aeronautics Systems has an opening for a Principal Systems Engineer (Electromagnetic Environmental Effects (E3)) to join our team of qualified, diverse individuals within…
Added 1 hour ago
Cloud Engineer SME
Ignite IT
Remote, United States
Analyze existing application architectures, infrastructure dependencies, batch schedules, data flows, and integration points.
Added 1 hour ago
Senior Network Security Engineer
Ignite IT
Remote, United States
We are seeking a Senior Network Security Engineer for an operations-first role supporting enterprise network security infrastructure across on-premises, remote-access, hybrid-cloud, and…
Added 1 hour ago
Senior USPS Android Mobility & UEM Integration SME
Ignite IT
Remote, United States
Engineer and support application distribution using USPS SOTI UEM and/or Government Agency Microsoft Intune, as applicable to the approved integration architecture.
Added 1 hour ago
Senior Identity Engineer
Ignite IT
Remote, United States
Ignite IT is seeking an experienced Senior Identity and Access Management (IAM) Engineer to support enterprise identity and directory services for the U.S. Census Bureau.
Added 1 hour ago
Senior Linux Administrator
Ignite IT
Remote, United States
Ignite IT is seeking a very experienced, senior-level Red Hat Linux Admin/Engineer to join and provide dedicated support to the Unix Management Branch of the Computer Services Division on…
Added 1 hour ago
Systems Engineer
IESE Solutions
El Segundo, CA
IESE Solutions is seeking a Systems Engineer, specialized in Systems of Systems (SoS) Architectures, in El Segundo, CA, to provide systems engineering, mission architecting and analysis…
Added 1 hour ago
Senior Ground Segment Systems Engineer
IESE Solutions
El Segundo, CA
IESE Solutions is seeking an experienced Senior Ground Segment Systems Engineer to support to the US Space Force (USSF) in developing, deploying, and sustaining a National Security Space…
Added 1 hour ago
Embedded Software Engineer, Merlin Platform
Amazon Kuiper Manufacturing Enterprises LLC
Redmond, WA
Take ownership of the complete software development lifecycle, encompassing design, testing, deployment, and mission integration.
Added 1 hour ago
ATE (Automated Test Equipment) Systems Engineer
Insight Global
Huntsville, AL
…and depot repair seeking a hands-on Automated Test Equipment Engineer to develop, integrate, troubleshoot, and sustain test systems for radar, RF, avionics, and defense electronic…

Advanced Micro Devices, Inc

Principal Semiconductor Packaging Technologist – Customer Solutions

San Jose, CA, United States

Apply About employer

Applications open in a new tab.

Job details

Apply by: Nov 10, 2027
Posting language: English
Posted: Nov 10, 2026

Original job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.

Role Summary Advanced packaging is at the center of everything happening in semiconductors right now - AI accelerators, next-generation FPGAs, embedded SoCs, and custom ASICs are all pushing the limits of what packaging technology can deliver. AECG Packaging is where that work gets done.

We are looking for a Principal Packaging Integration Engineer who can do two things exceptionally well: drive technically sound packaging architecture decisions and be the trusted engineering partner our customers rely on to bring those decisions to life.

This is not a support role. You will own your programs - technically and commercially - from architecture through qualification, pulling together design, process, quality, test, and supply chain into decisions that are smart, manufacturable, and on schedule.

If you are a seasoned packaging engineer who has outgrown pure technical execution and wants a role where your judgment, relationships, and technical depth all matter equally - this was written for you.

Key Responsibilities

Drive packaging architecture decisions and IC-PKG-PCB co-design for FPGA, embedded SoC, and custom ASIC programs spanning 2.5D/3D, OPC, and MOP technologies.
Lead DFM and DFMEA reviews and packaging supply qualification, partnering with OSAT/substrate suppliers on manufacturable, reliable, application-ready solutions.
Serve as the primary customer-facing contact for assigned programs - representing the packaging organization and translating customer requirements into internal technical direction.
Organize and lead cross-functional task forces across silicon design, packaging, SI/PI, thermal-mechanical, quality and reliability test, and supply chain to resolve issues, align decisions, and keep programs on schedule.
Proactively fill gaps between functional groups and track commitments to genuine closure.
Build durable, trusted relationships with customers and internal partners through responsive, patient, detail-oriented follow-through.

Qualifications

Expert-level experience in semiconductor packaging technology integration, with working knowledge of 2.5D/3D integration, OPC, MOP, and IC-PKG-PCB co-design and co-development.
Strong experience with DFM/DFMEA/PFMEA and packaging supply qualification (OSAT/substrate/materials partners).
Demonstrated experience engaging customers directly and coordinating cross-functional task forces to closure.
Fluent, confident communicator with both engineering teams and customers; detail-oriented, patient, and customer-driven.
Willing to step out to fill gaps between functional groups and drive issues to closure.
Bachelor's or Master's degree in Electrical, Materials, Mechanical, or Semiconductor Engineering, or a related field.

Preferred Skills

Strong knowledge of SoC architecture and critical IP blocks (SerDes, PHYs, memory controllers, I/O subsystems) and how they drive packaging and interconnect requirements.
Familiarity with IC-package-PCB co-design and analysis tools (e.g., Cadence, Synopsys, Ansys, or equivalent EDA platforms).
Familiarity with UCIe (Universal Chiplet Interconnect Express) and other die-to-die/chiplet interconnect standards.
Experience with signal integrity and power integrity (SI/PI) analysis across the package and board interconnect.
Understanding of high-speed I/O interface design considerations at the package level.
Familiarity with DDR/memory interface routing, timing, and packaging constraints.
Experience with power plane and PDN (power delivery network) optimization across silicon, package, and board.
Ability to evaluate design considerations and trade-offs (performance, cost, manufacturability, reliability, schedule) and communicate them clearly to both engineering and customer stakeholders.

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

Apply About employer

More about this job

Skills

Packaging
Supply chain management
Printed circuit boards
Ansys
EDA

Report this job