Jobs in the United States

25+ jobs

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Added 9 mins ago
Mechanical Engineer
Actalent
Oshkosh, WI
We are seeking a Mechanical Engineer to support the design, development, integration, and validation of mechanical systems for heavy-duty vehicle applications. This role will serve as a key…
Added 39 mins ago
Staff Package Design Engineer
Renesas Electronics
Tempe, AZ
This role requires deep expertise in advanced packaging R&D, cross-domain co-design, and the ability to define methods and procedures for complex, multi-die integration assignments. You…
Added 1 hour ago
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Sr Electrical Engineer Certification And Qualification
Actalent
New Freedom, PA
- $90 to $100 USD / hour
The Senior Electrical Certification & Qualification Engineer leads the evaluation, qualification, testing, and certification of highamperage power distribution and protection components…
Added 1 hour ago
Component Packaging Engineer II
Insight Global
Fort Washington, PA
Our Large Consumer Manufacturing Client is seeking a Package Engineer to join their team in Fort Washington, PA. This individual will be expected to be onsite a minimum of 2 days a week.…
Added 1 hour ago
Desktop / Endpoint Engineer
SEI INVESTMENTS COMPANY
Oaks, PA
Added 1 hour ago
Process Control Engineer
Domtar Paper Company LLC
Johnsonburg, PA
Added 1 hour ago
Product Support Engineer (PSP)
Veeco Instruments
Horsham, PA
Added 1 hour ago
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Customer Engagement Engineer (FaST)
KLA Corporation
Hillsboro, OR
- $136,700 to $232,400 USD / year
…chips, specialty semiconductors, wafers, reticles, advanced packaging, process equipment and materials. We also develop technologies for specialty processes, IC substrates, and PCB…
Added 1 hour ago
Packaging Engineer - Jackson Area
The Pivot Group Network
Jackson · Jackson, MI
Are you a dedicated professional with a passion for excelling as a packaging engineer? The Pivot Group Network, a Michigan manufacturing-focused recruiting group, is committed to fostering…
Added 1 hour ago
Packaging Engineer - Wixom Area
The Pivot Group Network
Wixom · Wixom, MI
Are you ready to take on a challenging and rewarding opportunity in packaging engineer? The Pivot Group Network, a Michigan manufacturing-focused recruiting group, is committed to building…
Added 1 hour ago
Mechanical Engineer, Fluids & Packaging
Mach Industries
Victorville, CA
Mach Industries is seeking a Mechanical Engineer with experience in fluid systems and hardware packaging. You’ll develop fluid-related mechanical hardware and packaging solutions for…
Added 1 hour ago
Packaging Engineer - Cheboygan Area
The Pivot Group Network
Cheboygan · Cheboygan, MI
Are you a detail-oriented professional with a passion for excelling as a packaging engineer? The Pivot Group Network, a Michigan manufacturing-focused recruiting group, is dedicated to…
Added 1 hour ago
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Software Engineer (Java Spring Boot/Python) (SAB-2611-02)
Sabre Engineering Inc
Columbia, MD
- $120,000 to $150,000 USD / year
Added 1 hour ago
Senior DevSecOps Platform Engineer
CGI Technologies and Solutions, Inc.
Baltimore, MD
CGI is seeking a Senior DevSecOps Platform Engineer to build, evolve, and set direction for enterprise shared services platforms that support development teams across a large federal…
Added 1 hour ago
Controls Engineer II
ASR Group/Domino Sugar
Baltimore, MD
The Senior Controls Engineer is the refinery’s technical authority for automation, instrumentation, industrial networking, and process control systems. This role ensures reliable, secure,…
Added 1 hour ago
Mechanical Engineer 3
Lam Research
Tualatin
As a Mechanical Engineer at Lam, you're designing and defining cutting-edge mechanical and electro-mechanical systems. Your role involves feasibility studies, testing, and guiding teams in…
Added 1 hour ago
Mechanical Engineer 3
Lam Research
Tualatin
As a Mechanical Engineer at Lam, you will design and define cutting-edge mechanical and electro-mechanical systems. Your role involves conducting feasibility studies, testing, and guiding…
Added 2 hours ago
Process Integration Engineer, APTD
Micron Technology
Boise
The Advanced Packaging Technology Development (APTD) team is developing the packaging and integration technologies that will power future generations of memory products. We bring together…
Added 2 hours ago
Senior Manufacturing Engineer
Rondo Energy
Alameda, CA
We are looking for a hands-on Manufacturing Engineer to lead the development, optimization, and scale-up of the assembly processes behind our modular thermal battery system, taking it from…
Added 2 hours ago
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Senior/Staff Nanofabrication and Characterization Engineer
Neurophos
Austin, TX
- $160,000 to $190,000 USD / year
We are seeking a hands-on Nanofabrication and Characterization Engineer to build and characterize prototype metasurface chips for our optical vector-matrix multiplication (OVMM) engine.…
Added 2 hours ago
Sr. Developer
HEALTHSTREAM INC
Remote, United States
…end to end - Apex, Lightning Web Components, integrations, packaging, and subscriber-org support - and help raise the technical bar for the…
Added 3 hours ago
Senior Manufacturing Engineer – Photonics Manufacturing & NPI
PsiQuantum
Milpitas, CA
Develop manufacturing processes for optical packaging, precision optical alignment, electro-optical integration, and final assembly.
Added 3 hours ago
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Staff Backend Engineer, Financial Engineering
OpenAI
San Francisco, CA
- $266,000 to $445,000 USD / year
- Experience with product catalogs, packaging and bundles, workspace management, entitlements, or usage metering.
Added 3 hours ago
MGH-Air and Gas Tester
Rheem
Montgomery, AL
Visual inspection of tanks for leaks using air pressure or water or inspect gas lines for heater gas leaks before packaging.
Added 3 hours ago
IG
Senior Staff Sustaining Engineer
Insight Global
Irvine, CA
- $165,000 to $190,000 USD / year
Experience with disposable or single-use medical devices, including polymers, adhesives, injection molding, or sterile packaging.

Advanced Micro Devices, Inc

Advanced Substrate Design & Process Integration

Austin, TX, United States

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Job details

Apply by: Nov 3, 2027
Posting language: English
Posted: Nov 3, 2026

Original job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE

Lead the development of next-generation substrate architecture, design rules, and technology platforms that enable AMD's future packaging solutions. This role focuses on substrate design enablement, process integration, design-for-manufacturability (DFM), design-for-yield (DFY), reliability, and electrical performance optimization. This role is for a seasoned engineer to define substrate technology requirements and design methodologies that bridge product needs with manufacturing capabilities. You will work closely with package architects, substrate designers, silicon teams, and manufacturing partners to co-optimize substrate solutions for performance, yield, reliability, and cost.

THE PERSON

The ideal candidate is a technical leader with deep expertise in substrate design architecture, process integration, substrate manufacturing technologies, and package-system co-design. They have developed substrate design rules and technology platforms used in advanced semiconductor products. They understand the tradeoffs between electrical performance, mechanical reliability, manufacturability, and cost, and are skilled at translating product requirements into scalable substrate technologies.

KEY RESPONSIBILITIES

Substrate Architecture & Design Rule Development

Define substrate technology requirements and design roadmaps for future AMD products.
Develop substrate design rules, stack-up methodologies, routing architectures, and technology guidelines.
Establish scalable design infrastructures supporting future substrate technology nodes.
Drive substrate architecture development across line/space scaling, via technologies, and advanced package integration.

Process Integration

Lead design-process co-optimization activities across substrate manufacturing technologies.
Define process-aware design methodologies that improve manufacturability and reduce development risk.
Collaborate with suppliers to establish process windows, design limitations, and technology capabilities.
Drive technology readiness assessments for emerging substrate platforms.

Design for Yield (DFY)

Develop design methodologies that maximize manufacturing yield and process robustness.
Identify systematic design sensitivities impacting supplier yield and manufacturing cost.
Define design guidelines and best practices that improve technology scalability.
Drive design-related yield learning and continuous improvement initiatives.

Reliability Engineering

Lead substrate reliability strategy and design rule development for mechanical and electrical robustness.
Develop reliability-aware design guidelines for advanced package applications.
Partner with reliability teams to understand failure mechanisms and translate learning into improved design requirements.
Drive technology qualification and design robustness assessments.

Performance Optimization

Drive substrate architecture solutions for signal integrity, power integrity, and high-speed package performance.
Collaborate with package and silicon architects to optimize electrical performance across the package system.
Develop technology solutions supporting future AI, HPC, and heterogeneous integration products.
Balance performance requirements with manufacturability, reliability, and cost objectives.

Supplier Technology Leadership

Influence substrate supplier technology roadmaps and capability development.
Evaluate emerging substrate technologies and manufacturing innovations.
Establish design requirements and technical targets for development partners.
Build strategic technology partnerships across the substrate ecosystem.

PREFERRED EXPERIENCE

Experience in advanced packaging, substrate design, or package technology development.
Deep expertise in substrate stack-up architecture, routing technologies, HDI design, and advanced package substrates.
Extensive experience developing substrate design rules for manufacturing and reliability.
Strong understanding of signal integrity, power integrity, and package electrical performance.
Experience with design-for-manufacturability, design-for-yield, and design-process co-optimization.
Strong understanding of substrate manufacturing processes and process integration principles.
Experience supporting advanced package architectures including chiplet, 2.5D, and heterogeneous integration solutions.
Proven ability to influence technical direction across multiple organizations and suppliers.
Demonstrated success presenting strategy and technical roadmaps to senior leadership.

This role is not eligible for visa sponsorship

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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Skills

Design process
Packaging
Product comprehension
Architectural design
Process improvement
Leadership
Manufacturing processes

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